Transponder Module Chip Mount With Recessed Antenna Contacts
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Solution Overview
Problem
Transponder modules with chip housings face challenges in mechanical stress protection while maintaining a thin layer structure, which complicates printing and adhesive bonding due to visible thickening.
Innovation Solution
A transponder module design featuring a chip carrier with spaced chip and antenna contact arrangements, insulating surfaces, and a chip recess in the antenna substrate, allowing for electrical contact without external antenna contact surfaces and enabling a thin, uniformly adhesive structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a chip housing is provided to protect the chip from mechanical stress, then the chip is adequately protected, but a local thickening is formed that is easily visible and complicates printing and adhesive bonding
Solution Approach 1:
The chip is extracted from a separate housing structure and directly integrated into the antenna substrate through a recess. The housing function is absorbed by the antenna substrate itself, eliminating the need for an additional housing component that would create visible thickening and compromise surface uniformity.
Solution Approach 2:
The chip housing function is merged with the antenna substrate by forming a recess directly in the substrate. This combines the structural support and chip protection functions into a single integrated component, eliminating the need for separate housing elements that would disrupt the surface profile.
2Reliability
If contact surfaces are formed on the opposite side of the antenna substrate, then electrical contact with the antenna is achieved, but the layer structure thickness increases
Solution Approach 1:
The contact arrangement is moved from a two-dimensional surface contact on the opposite side of the substrate to a three-dimensional edge contact within a recess. This dimensional change allows electrical contact to be established through the side walls of the recess rather than requiring additional thickness for surface contacts.
Solution Approach 2:
The contact arrangement is nested within the recess formed in the antenna substrate. This nesting approach allows the contact surfaces to be positioned within the substrate thickness rather than adding to it, effectively hiding the contact structure within the existing layer profile.
Data Source
Figure 1~3
Figure 4~5
AI summary
The invention relates to a chip mount (15) for making contact with a chip (16) and an antenna (13) which is arranged on an antenna substrate (17, 54, 61), wherein the chip mount has a mount substrate (18) which is in the form of a strip and is provided with a chip contact arrangement (29), which is at a distance from longitudinal ends (25, 26) of the mount substrate, for making electrical contact with a chip, and is provided with two antenna contact surfaces (27, 28), which hold the chip contact arrangement between them for making electrical contact with the antenna, wherein the chip contact arrangement and the antenna contact surfaces are located on an application surface (31) of the chip mount, and at least one isolation surface (20) is formed between the chip contact arrangement and the antenna contact surfaces on the application surface. The invention also relates to a chip mount arrangement having a plurality of chip mounts, which are arranged on a film-like sheet mount in at least one row arrangement extending in the longitudinal direction of the sheet mount, wherein the individual chip mounts extend in the longitudinal direction of the sheet mount.