Transponder Embedding in Thermoplastic Spatial Structures
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Solution Overview
Problem
Existing spatial structures with transponders require high effort and additional costs due to the complex positioning of solder contacts for connecting coils to chips, making it difficult to produce thin, flexible, and high-quality transponder structures.
Innovation Solution
A sheet-like spatial structure with a transponder where the chip is connected to a non-conducting substrate using an electrically conductive film, forming large contact areas that align with the coil ends, allowing for a solder-free, mechanically durable connection, and embedding the antenna and chip in thermoplastic material with outer layers for protection and lamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder contacts are used to connect coil ends to chip, then electrical connection is achieved, but positioning effort and production cost increase
Solution Approach 1:
A module with a substrate and electrically conductive film acts as an intermediary between the coil and chip. The conductive film creates large contact areas that are aligned with coil ends, enabling solder-free mechanical contact connection. This intermediary structure eliminates the need for precise positioning of small solder contacts while ensuring reliable electrical connection.
Solution Approach 2:
The invention changes the connection parameter from small solder contacts requiring precise positioning to large contact areas formed by conductive film. The module provides large contact areas that do not require exact positioning between connection points, fundamentally changing the dimensional parameters of the connection interface.
2Length of stationary object
If solder contacts are minimized in size, then thin flexible structure is achieved, but positioning precision requirements increase
Solution Approach 1:
Instead of minimizing contact size to achieve thin structure (which increases positioning precision requirements), the invention inverts the approach by using large contact areas from the conductive film. This allows thin flexible structure to be achieved without increasing positioning precision requirements, as the large contact areas provide tolerance to misalignment.
3Manufacturing precision
If multiple lamination steps are performed, then embedding quality improves, but thermal and mechanical loading increases
Solution Approach 1:
The module with substrate and conductive film is prepared in advance with the chip already connected. This preliminary preparation allows the entire assembly to be embedded in a single lamination step, rather than performing multiple lamination steps. The single lamination process reduces cumulative thermal and mechanical loading while achieving high embedding quality.
4Device complexity
If chip is exposed without clearance, then structure simplicity increases, but chip and connection areas are vulnerable to damage
Solution Approach 1:
The chip is nested within a clearance in the thermoplastic material, and the module with substrate is nested over the chip. This nested arrangement protects the chip and connection areas while maintaining a compact, simple overall structure. The substrate of the module provides additional protection during lamination and operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces production effort and cost, achieving a thin, flexible, and high-quality transponder structure with durable electrical connections and reduced thermal and mechanical loading, resulting in a composite with low failure rates and no perceptible elements by feel.
Implementation Method 1
The thermoplastic material is (hot) laminated together with the placed-on antenna and the module between a respective outer layer or overlay on each side of the thermoplastic material. By the lamination, i.e. application of heat and pressure, the antenna is at least partially embedded in the thermoplastic material
Implementation Method 2
The thermoplastic material is (hot) laminated together with the placed-on antenna and the module between a respective outer layer or overlay on each side of the thermoplastic material
Implementation Method 3
The thermoplastic material is fused with the two outer layers in a sandwich-like manner
Data Source
AI summary
A spatial structure having a transponder comprising a planar antenna (6) and a chip (3) connected to the antenna (6), wherein the antenna (6) is at least partially embedded in a planar thermoplastic material (5) of the spatial structure, and a cavity is provided in the thermoplastic material (5) for partial holding the chip (3), wherein a planar module (1) is provided having a non-conducting substrate (2) that cannot be laminated with the thermoplastic material, the chip (3) being able to be connected to said module by way of an electrically conducting film, wherein the film forms contact areas (4a, 4b) for connecting the ends (7, 8) of the antennas (6) to the chip (3) on the module (1), and wherein the thermoplastic material (5) is laminated together with the module (1) and the antenna (6) between two cover layers (9, 10) in sandwich fashion, the contact areas (4a, 4b) of said module being aligned with the ends (7, 8) of the antenna (6).