Transponder Arrangement With Inductive Coupling and Wire Bonding
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Solution Overview
Problem
RFID transponders on flexible substrates face challenges due to expensive print-and-etch processes and interference from metallic components like heating elements in vehicles, which block RF signals and increase manufacturing costs.
Innovation Solution
A transponder arrangement with dipole antenna elements on one surface of a substrate and a supplemental antenna element on the opposing surface, separated by an air-filled void or low dielectric material, providing inductive coupling and reducing interference from metallic structures, and using fine gauge wire instead of printed patterns to avoid hazardous chemicals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If print-and-etch processes are used to create wiring patterns on flexible substrates, then antenna functionality is achieved, but manufacturing cost increases and hazardous waste is generated
Solution Approach 1:
The patent extracts the harmful print-and-etch process from the manufacturing sequence and replaces it with direct wire bonding. The wiring pattern is applied directly to the substrate using fine gauge wires attached to connection pads, eliminating the need for chemical etching processes and their associated hazardous waste while reducing manufacturing cost
Solution Approach 2:
The patent replaces the chemical-based print-and-etch process with a mechanical wire bonding process. Fine gauge wires are physically attached to connection pads on the substrate to form antenna elements, substituting chemical manufacturing with a mechanical assembly process that avoids hazardous chemicals
2Ease of manufacture
If metallic components like heating elements are present in the substrate, then structural functionality is provided, but RF signal transmission is blocked
Solution Approach 1:
The patent applies local quality by positioning the third antenna element on the opposite side of the substrate from the metallic heating element. This spatial separation creates a local region free from metallic interference where the RF transponder can operate effectively, while the metallic component remains in place to provide its heating function
Solution Approach 2:
The patent resolves the interference problem by moving to another dimension - placing the third antenna element on the opposite face of the substrate from the metallic heating element. This three-dimensional arrangement allows both the heating element and antenna to coexist without significant RF interference
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances RF signal transmission by improving inductive coupling and reducing interference from metallic components, while reducing manufacturing costs and environmental impact by eliminating hazardous chemicals.
Implementation Method 1
The third antenna element is disposed on the second surface of the substrate and is inductively coupled to the first and second antenna elements
Data Source
AI summary
A transponder arrangement includes a substrate, an RF transponder, and first, second, and third antenna elements. The substrate has a first surface and an opposing second surface. The RF transponder is disposed on the first surface of the substrate and has a first connection pad and a second connection pad. The first antenna element is disposed on the first surface of the substrate and is connected to the first connection pad. The second antenna element is disposed on the first surface of the substrate and is connected to the second connection pad. The third antenna element is disposed on the second surface of the substrate and is inductively coupled to the first and second antenna elements.