Transponder IC Module Sealing with Insulating Sheet
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Solution Overview
Problem
Conventional non-contact IC card and IC tag technologies face issues with static electricity infiltration and surface flatness, leading to potential damage to the IC module and failure in durability tests due to exposure of sealing resin sections and gaps between base materials and IC modules.
Innovation Solution
A transponder design featuring a flexible antenna coil on a first base material with an IC module connected to it, and a second base material with an opening that exposes the IC module, using an insulating sealing material to fill gaps and cover the IC module, ensuring electrical insulation and preventing static electricity and external substance infiltration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the opening in the base material is made larger than the sealing resin section to avoid pressing, then the IC module is protected from breakage, but a gap forms between the sealing resin section and the base material allowing static electricity infiltration
Solution Approach 1:
The patent introduces a flexible insulating sheet as an intermediary component between the base material and the IC module. This sheet fills the gap formed by the larger opening, preventing static electricity infiltration while allowing the opening to remain larger than the IC module for protection during pressing operations. The insulating sheet acts as a mediator that resolves the conflict between gap prevention and module protection.
Solution Approach 2:
The patent employs a flexible insulating sheet that can conform to the IC module and fill irregular gaps. This thin film structure provides electrical insulation and gap sealing without adding significant bulk, allowing the opening to be larger than the IC module while maintaining protection against static electricity infiltration.
2Object-affected harmful factors
If the opening in the base material is made smaller than the sealing resin section to prevent gap formation, then static electricity infiltration is prevented, but the IC module may break during pressing operations
Solution Approach 1:
The flexible insulating sheet serves as a mediator that allows the opening to be smaller than the sealing resin section for gap prevention, while still protecting the IC module during pressing. The sheet distributes the pressing force and prevents direct transmission of external forces to the IC module, resolving the conflict between gap prevention and module protection.
3Reliability
If the outer shape of the opening is made larger than the sealing resin section to avoid pressing, then the IC module is protected from breakage, but the outer surface flatness is compromised
Solution Approach 1:
The flexible insulating sheet can be pressed to conform to the opening boundaries, allowing the opening to be larger than the IC module for protection while maintaining outer surface flatness. The sheet's flexibility enables it to adapt to the required shape without creating surface irregularities that would fail flatness tests.
4Shape
If the outer shape of the opening is made smaller than the sealing resin section to ensure flatness, then the outer surface flatness is maintained, but the IC module may break during pressing operations
Solution Approach 1:
The flexible insulating sheet acts as a mediator that allows the opening to be smaller than the sealing resin section for flatness maintenance, while still protecting the IC module during pressing. The sheet distributes pressing forces and prevents direct transmission to the IC module, resolving the conflict between flatness and module protection.
Data Source
AI summary
A transponder includes an inlet including an antenna sheet, which includes an antenna coil on a flexible first base material, and an IC module connected to the antenna coil, and a second base material, which has an opening for exposing at least a part of the IC module and is bonded to the inlet; a sealing material having electrical insulation is provided between the IC module and an inside face of the opening.