Transponder Layer Chip Contact and Laminate Reduction
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Solution Overview
Problem
Existing contactless chip cards require a minimum of four laminate layers due to the need for separate layers to accommodate the antenna, chip module, and housing, leading to increased external dimensions and complexity in production.
Innovation Solution
A transponder layer with a circular wire conductor antenna and a recess in the antenna substrate allows the chip to be securely accommodated with convex contact flattened areas, eliminating the need for a housing and reducing the number of laminate layers required, as the chip is contacted directly with the wire conductor ends without a contact carrier.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a chip module with contact carrier and housing is used, then the chip can be mechanically protected and contacted, but the external dimensions and number of laminate layers increase
Solution Approach 1:
The invention extracts and eliminates the housing and contact carrier from the chip module, integrating only the essential elements (chip and antenna) directly into the laminate structure. The chip is mounted directly on the antenna substrate without a separate housing, and the contact carrier is replaced by direct contact between antenna ends and chip contacts, thereby reducing external dimensions while maintaining functional reliability
Solution Approach 2:
The invention merges multiple previously separate components into a single integrated laminate layer. The antenna substrate, chip mounting area, and contact elements are combined into one laminate layer, eliminating the need for separate housing and contact carrier layers. This consolidation reduces the total number of laminate layers from four or more to just three, while maintaining mechanical protection and electrical contacting functions
2Reliability
If a housing and contact carrier are used to accommodate the chip, then the chip is protected and contacted, but the number of laminate layers increases to at least four
Solution Approach 1:
The invention combines the functions of the housing and contact carrier into the antenna substrate itself. The antenna substrate is designed with a recess for chip mounting and integrated contact elements, eliminating the need for separate housing and contact carrier layers. This merging reduces the laminate structure from four or more layers to just three layers (antenna substrate, outer layer, and back layer), significantly simplifying the device complexity
Solution Approach 2:
The antenna substrate is given multiple functions: it serves as the antenna support, the chip mounting platform, the contact carrier, and part of the protective structure. By making the antenna substrate multi-functional, the invention eliminates the need for separate dedicated layers for each function, thereby reducing the total number of laminate layers required
3Device complexity
If wire conductor ends with circular cross section are used, then the antenna structure is simple, but the connection areas for contacting the chip are insufficient
Solution Approach 1:
The invention applies local quality by changing the cross-sectional shape of the wire conductor ends from circular to flattened (oval or rectangular) specifically at the contact areas. The antenna wire maintains its simple circular cross-section for most of its length, but at the ends that contact the chip, the cross-section is locally modified to provide enlarged connection areas. This localized change increases contact area without significantly complicating the overall antenna structure
Data Source
Figure 1~3
Figure 4a~5b
Figure 6a~7
AI summary
The invention relates to a transponder layer (10), in particular for producing a chip card, comprising an antenna substrate (12), on an antenna side (11) of which an antenna (14) made of a wire conductor (13) is provided and which has a chip receiving area formed by a recess in the antenna substrate, wherein a chip (21) is received in said chip receiving area. Wire conductor ends which are used to form terminal ends (15) of the antenna are formed on a chip receiving area base (20) which is set back relative to the rear face (26) of the antenna substrate (12). The chip is received in the chip receiving area such that terminal contacts (22) arranged on a contact face (36) of the chip are contacted with flat contact areas (19) of the terminal ends (15), and the chip semiconductor body (28) rear face (27) which lies opposite the terminal contacts are substantially flush with the rear face of the antenna substrate. The invention further relates to a method for producing a transponder layer.