Flexible Transponder with Non-Woven Foil Support
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Solution Overview
Problem
Existing contactless transponder production methods face challenges in achieving flexibility while maintaining mechanical stability and stress resistance, often requiring additional lamination steps that increase costs and compromise surface quality.
Innovation Solution
A multi-layer laminate support structure incorporating a thin and porous non-woven foil between thermoplastic layers enhances flexibility and stress resistance, allowing for easier lamination and reduced shrinkage, with the non-woven foil being almost invisible after lamination and providing reinforcement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If smoother plastic materials such as polyurethane or polyethylene terephthalate glycol are used to produce thinner transponders, then flexibility is improved, but stress resistance and mechanical solidity are weakened
Solution Approach 1:
The patent applies composite materials by combining thermoplastic layers with a non-woven support layer to create a multi-layer laminate structure. This composite construction allows the transponder to achieve both flexibility (from the thin thermoplastic layers) and mechanical strength (from the non-woven support layer), resolving the contradiction between thinness and stress resistance
Solution Approach 2:
The patent uses thin thermoplastic layers (0.05-0.5 mm) as flexible shell structures that provide the necessary flexibility while being reinforced by the non-woven support layer. This approach enables the transponder to be thin and flexible yet maintain adequate mechanical strength through the combined structure
2Ease of manufacture
If non-woven material foils are inserted in the laminated structure to improve flexibility, then ease of manufacture is improved, but adhesion quality deteriorates due to porosity requirements for plastic penetration
Solution Approach 1:
The patent changes the parameters of the non-woven support layer, specifically using a very thin layer (5-50 µm) with controlled porosity. This parameter optimization allows the plastic material to penetrate sufficiently for adhesion while maintaining the flexibility benefits of the non-woven structure, resolving the contradiction between ease of manufacture and adhesion quality
Solution Approach 2:
The patent applies local quality by positioning the non-woven support layer specifically between the thermoplastic layers where flexibility is needed, while the thermoplastic layers themselves provide the adhesion surfaces. This localized application of different material properties resolves the contradiction between flexibility and adhesion quality
3Manufacturing precision
If additional lamination steps are performed to improve surface quality, then appearance quality is improved, but manufacturing complexity and costs increase
Solution Approach 1:
The patent merges the support function and the surface quality function into a single integrated structure. The thermoplastic layers serve dual purposes: providing structural integrity and delivering the required surface quality for printing and appearance, eliminating the need for separate additional lamination steps and reducing manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a flexible and robust transponder with minimal shrinkage, enabling high-temperature lamination without mechanical stress, and preventing deformation, thus improving manufacturing efficiency and product integrity.
Implementation Method 1
said first and second foils (2, 2') being thermoplastic layers
Implementation Method 2
at least one non-woven foil (3) with a grammage of less than 25 g/m2 positioned in direct proximity of at least one of the thermoplastic layers (2, 2')
Data Source
AI summary
The transponder with an electronic unit comprising an antenna coil (4) connected to a chip module (5) embedded in a multi-layer laminate support (1) comprises at least one flexible thermoplastic layer (2) disposed on both sides of the electronic unit wherein the multi-layer laminate support further comprises a non-woven foil (3) with a grammage of less than 25 g/m2.


