Transport Packaging for Power Semiconductor Modules
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Solution Overview
Problem
Existing packaging solutions for power semiconductor modules are inadequate in protecting against mechanical damage and electrostatic discharge during transport, and they are difficult to open for inspection without risking damage to the modules.
Innovation Solution
A transport packaging arrangement featuring a conductive composite cardboard cover layer, an intermediate layer with recesses for the modules, and a cover film that is conductive or dissipative, allowing for electrostatic protection and easy removal of modules without tools, while maintaining accessibility for marking reading without opening the packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If simple cardboard boxes are used for packaging, then the packaging is easy to open and access, but they do not adequately protect the power semiconductor modules from mechanical effects during transport
Solution Approach 1:
The packaging is divided into multiple functional layers: an outer cardboard box for structural strength, an intermediate layer with recesses for module positioning, and an inner plastic film for electrostatic protection. Each layer performs a specific protective function while maintaining ease of opening through detachable connections between layers.
Solution Approach 2:
The packaging combines different materials with complementary properties: cardboard provides mechanical strength and ease of opening, plastic film provides electrostatic protection and module enclosure, and the intermediate layer (cardboard or foam) provides positioning and cushioning. This composite structure resolves the contradiction between ease of opening and mechanical protection.
2Reliability
If skin packaging with plastic film is used, then electrostatic protection is provided, but the packaging is not accessible to a simple process of opening and removing the packaged goods
Solution Approach 1:
The packaging is segmented into detachable layers where the plastic film layer is connected to the cardboard box through separable adhesive connections. This allows the electrostatic protective film to be easily separated and removed without damaging the modules, resolving the contradiction between providing electrostatic protection and enabling easy opening.
Solution Approach 2:
The plastic film is pre-connected to the cardboard box at specific locations (e.g., at the edges or corners) with detachable adhesive connections. This preliminary arrangement allows for easy separation along predetermined lines, making the packaging accessible while maintaining electrostatic protection during transport.
3Loss of information
If the packaging is opened for customs inspection, then marking readability is achieved, but the power semiconductor modules can be touched directly leading to damage due to electrostatic discharge
Solution Approach 1:
The intermediate layer with recesses serves as a mediator between the outer packaging and the power semiconductor modules. During inspection, this layer can be partially removed or accessed to read markings on modules without requiring complete disassembly, and the recesses provide physical protection and positioning that prevents direct handling damage.
4Strength
If individual blisters with reinforcement structures are used, then mechanical protection is improved, but the packaging complexity increases
Solution Approach 1:
The packaging merges multiple protective functions into a unified multi-layer structure where the cardboard box, intermediate layer with recesses, and plastic film work together. The intermediate layer combines positioning recesses with mechanical support functions, eliminating the need for separate reinforcement structures while maintaining protection and reducing overall complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides robust mechanical protection, prevents electrostatic discharge, allows for non-invasive inspection, and facilitates easy and environmentally friendly disposal of the packaging, while maintaining high packing density and stability.
Implementation Method 1
The top layer, preferably designed as a composite cardboard that is conductive in its entirety, is designed flat and thus forms the basis of the transport packaging... the cover film consists of a conductive or dissipative plastic film with or without a metal-coated outer surface
Data Source
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AI summary
The application relates to an arrangement comprising at least one power semiconductor module and a transport package, wherein the power semiconductor module has a base element, a housing, and connection elements, and wherein the transport package comprises a top layer, an intermediate layer with recesses each associated with the at least one power semiconductor module, and a cover film. The top layer is formed flat with a first main surface facing the power semiconductor module to be arranged. The intermediate layer is arranged with its second main surface on this first main surface of the top layer.The associated power semiconductor module is arranged in at least one recess on the first main surface of the cover layer, wherein its base element lies on the first main surface of the cover layer, and wherein the cover film covers substantial parts of the housing of the at least one power semiconductor module and wherein the cover film is furthermore connected to the first main surface of the intermediate layer.