Transreflective Array Substrate 4-Mask Process
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The manufacturing process of transreflective liquid crystal displays is complex, has a low utilization rate of backlight, and is prone to micro contamination, leading to high energy consumption and limited environmental adaptability.
Innovation Solution
A 4-mask process is introduced for manufacturing the array substrate, simplifying the procedure by depositing and patterning transparent and reflective layers efficiently, reducing the number of steps and masking times, and enhancing the connection between electrodes, thereby improving productivity and reducing contamination risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a multi-step patterning process is used to form transmissive and reflective regions separately, then the manufacturing precision of electrode patterns is improved, but the device complexity and manufacturing time increase significantly
Solution Approach 1:
The patent combines the formation of transmissive region electrode and reflective region electrode into a single patterning step. A transparent conductive film is deposited across the entire substrate, then patterned once to simultaneously define both transmissive regions (where the film remains) and reflective regions (where the film is removed). This merging of operations reduces the number of patterning steps from multiple separate processes to a single integrated process, thereby reducing device complexity while maintaining manufacturing precision.
Solution Approach 2:
The transparent conductive film serves multiple functions: it acts as the pixel electrode in transmissive regions, provides a base layer for reflective regions, and defines both transmissive and reflective area boundaries through a single patterning process. This multi-functionality eliminates the need for separate electrode formation processes for different regions, simplifying the overall manufacturing process while maintaining precise control over electrode patterns.
2Manufacturing precision
If multiple patterning processes are employed to create different electrode regions, then the manufacturing precision is improved, but the productivity decreases due to increased processing time
Solution Approach 1:
The patent merges the patterning operations for transmissive and reflective regions into a single simultaneous process. One patterning step defines both types of regions by selectively removing the transparent conductive film in reflective areas while retaining it in transmissive areas. This consolidation reduces the total number of processing cycles required, thereby increasing manufacturing throughput and productivity while maintaining the precision needed for accurate electrode pattern formation.
3Manufacturing precision
If separate formation processes are used for transmissive and reflective electrodes, then the manufacturing precision is improved, but the chance of micro contamination increases
Solution Approach 1:
The patent combines the formation of transmissive and reflective electrode regions into a single patterning operation performed on a unified transparent conductive film layer. By conducting one patterning process instead of multiple separate processes, the number of times the substrate is handled, transferred, and re-positioned is reduced. This minimizes exposure to contamination sources and reduces the cumulative risk of micro contamination while still achieving precise electrode patterns through the single comprehensive patterning step.
4Productivity
If a simplified single patterning process is used, then the productivity is improved, but the manufacturing precision of complex electrode patterns may deteriorate
Solution Approach 1:
The single patterning process is designed to be universal, simultaneously defining transmissive regions, reflective regions, and their boundaries in one operation. The transparent conductive film is patterned to create distinct geometric configurations: continuous film regions for transmissive electrodes and removed film regions for reflective electrodes. This universal patterning approach maintains high manufacturing precision by using a single well-controlled process parameter set optimized for creating both region types with accurate boundaries and shapes.
Solution Approach 2:
The patterning process segments the substrate into distinct transmissive and reflective regions through selective film removal. The single patterning step creates spatial segmentation by defining where the transparent conductive film should remain (transmissive regions) and where it should be removed (reflective regions). This segmentation approach enables precise control over the spatial distribution and boundaries of different electrode types within a single unified process, maintaining manufacturing precision while improving productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The simplified process decreases the complexity and cost of manufacturing, increases the qualification ratio of products, and enhances the utilization rate of backlight by efficiently forming reflective and transmissive regions, allowing for improved display performance in various lighting conditions.
Implementation Method 1
depositing a transparent conductive film and a gate metal film on a substrate
Implementation Method 2
depositing a reflective layer film on the planarization film and forming a reflective layer
Data Source
AI summary
An array substrate, comprising a substrate and a data line and a gate line formed on the substrate. The data line and gate line cross each other to define a pixel region and the pixel region comprises a reflective region and a transparent region. The pixel region further comprises: a pixel electrode, formed with a transparent conductive film on the substrate and provided at least in the transparent region; a thin film transistor, formed on the substrate, the transparent conductive film being retained below the gate line and a gate electrode of the thin film transistor; a planarization film, covering the thin film transistor on the substrate; and a reflective layer, formed on the planarization film and disposed in the reflective region of the pixel region. A method of manufacturing the array substrate is provided.