Transverse Coil High Frequency Filter for Miniaturization
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Solution Overview
Problem
Existing high frequency components with LC circuits in multilayer bodies face challenges in miniaturization due to the size constraints of inductors and capacitors, which affect the steepness of attenuation poles and overall frequency support.
Innovation Solution
The design incorporates a transverse coil with interlayer connection conductors spirally wound around a winding axis perpendicular to the stacking direction, an internal capacitor arranged within the coil opening, and a longitudinal coil within the transverse coil opening, reducing the number of insulating layers and connection wiring, thereby miniaturizing the multilayer body while maintaining high frequency characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the number of turns of the coil is increased by using a spiral conductive pattern, then the inductance is increased, but the size of the multilayer body increases
Solution Approach 1:
The patent changes the winding direction of the coil from the stacking direction (longitudinal) to a direction substantially perpendicular to the stacking direction (transverse). This dimensional change allows the coil to be wound in a plane perpendicular to the stacking direction, enabling more turns to be packed into the same footprint area without increasing the overall size of the multilayer body, thereby increasing inductance while maintaining compact dimensions.
2Volume of moving object
If the size of the opening of the coil is increased, then the inductance is increased, but the size of the multilayer body increases
Solution Approach 1:
By winding the coil in a transverse direction perpendicular to the stacking direction, the patent utilizes the lateral dimensions of the multilayer body more efficiently. The coil opening can be optimized for inductance without extending the vertical height of the structure, allowing larger inductance values to be achieved within the same footprint area.
3Volume of moving object
If a longitudinal coil is used, then the inductance is increased, but the Q value of the LC resonant circuit is reduced due to higher resistance
Solution Approach 1:
The transverse coil configuration winds the conductive pattern in a direction substantially perpendicular to the stacking direction, creating shorter interlayer connection conductors. This reduces the total resistance of the coil compared to longitudinal winding, thereby improving the Q value of the LC resonant circuit while maintaining the required inductance.
Solution Approach 2:
The patent changes the geometric parameters of the coil by altering the winding direction from longitudinal to transverse. This parameter change reduces the path length of current flow through interlayer connections, decreasing resistive losses and improving the quality factor of the resonant circuit.
4Volume of moving object
If the number of insulating layers is increased to accommodate the capacitor, then the capacitance is increased, but the size of the multilayer body increases
Solution Approach 1:
The patent positions the capacitor within the coil opening, merging the spatial occupation of the coil and capacitor. This integrated arrangement allows both components to share the same lateral footprint area, eliminating the need for additional insulating layers that would otherwise be required if the capacitor were positioned outside the coil opening, thereby maintaining compact multilayer body dimensions.
Solution Approach 2:
The capacitor is nested within the coil opening, with the capacitor electrodes arranged in insulating layers that are interleaved with the coil structure. This nesting arrangement allows the capacitor to be accommodated within the existing lateral footprint of the coil, increasing capacitance without proportionally increasing the overall size of the multilayer body.
5Ease of manufacture
If connection wiring is added to connect the coil and capacitor, then the circuit is completed, but parasitic inductance and capacitance increase
Solution Approach 1:
The coil and capacitor are positioned adjacent to each other within the same lateral footprint area, with the capacitor located inside the coil opening. This merged arrangement minimizes the distance between connection points, reducing the length of connection wiring and thereby minimizing parasitic inductance and capacitance in the interconnects.
Solution Approach 2:
The insulating layers serve as an intermediary structure that facilitates direct electrical connection between the coil and capacitor terminals. The conductive patterns on adjacent insulating layers can be directly connected through via holes in the same or adjacent insulating layers, eliminating the need for long external connection wires and reducing parasitic effects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the Q value of the LC resonant circuit, reduces parasitic inductance and capacitance, and allows for adjustable attenuation poles, achieving satisfactory high frequency characteristics and miniaturization of the multilayer body.
Implementation Method 1
The transverse coil includes the linear conductors and the interlayer connection conductors spirally wound in a plurality of turns around a winding axis extending in a direction perpendicular or substantially perpendicular to the stacking direction
Implementation Method 2
The internal capacitor includes the planar conductors being arranged opposite to each other such that at least one of the insulating layers is disposed therebetween
Implementation Method 3
When an LC resonant circuit includes the transverse coil, the LC resonant circuit has an improved Q value
Data Source
AI summary
A high frequency component includes a multilayer body including a plurality of insulating layers stacked in a stacking direction, linear conductors extending along the insulating layers, interlayer connection conductors extending through at least one of the insulating layers, and planar conductors extending along the insulating layers. The high frequency component further includes transverse coils and internal capacitors. Each of the transverse coils includes the linear conductors and the interlayer connection conductors spirally wound in a plane in a plurality of turns around a winding axis extending in a direction perpendicular or substantially perpendicular to the stacking direction. Each of the internal capacitors includes the planar conductors being opposed to each other such that at least one of the insulating layers is disposed therebetween, the internal capacitor being arranged within a coil opening of the transverse coil when viewed along the winding axis of the transverse coil.