Transverse-Flow Cooler Assembly for Uniform Module Cooling
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Solution Overview
Problem
Conventional cooler assemblies for electronic modules often result in non-uniform cooling and inefficient fluid pumping due to serial heat transfer and pressure requirements, leading to performance discrepancies and energy inefficiencies.
Innovation Solution
The cooler assemblies described herein direct cooling fluid in a transverse direction perpendicular to the longitudinal axis, using internal manifolds and heatsinks to cool electronic modules in parallel, with customizable flow control features to ensure uniform temperature and efficient fluid distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If cooling fluid flows along the longitudinal axis to absorb heat from each electronic module in series, then the cooling system can be simple in structure, but the temperature uniformity across modules deteriorates and pumping energy requirements increase
Solution Approach 1:
The cooling system is segmented into multiple transverse cooling channels, each independently serving an electronic module. This segmentation allows parallel cooling operation, improving temperature uniformity while maintaining structural simplicity through modular channel design
Solution Approach 2:
The cooling fluid flow direction is changed from longitudinal (parallel to the axis) to transverse (perpendicular to the axis). This dimensional change enables parallel heat transfer paths, achieving uniform temperature distribution across all modules without increasing system complexity
2Volume of stationary object
If cooling fluid flows along the longitudinal axis in series, then the cooling system can be compact, but the pumping energy requirements and pressure losses increase
Solution Approach 1:
The cooling system is divided into multiple independent transverse channels, allowing parallel fluid flow paths. This reduces the total flow resistance and pumping energy requirements while maintaining a compact form factor through efficient space utilization in each channel
Solution Approach 2:
By changing the flow direction from longitudinal to transverse, the system achieves shorter flow paths and reduced pressure losses. The transverse configuration allows fluid to enter and exit at optimal points, minimizing pumping energy while maintaining compact dimensions
3Ease of manufacture
If cooling fluid flows along the longitudinal axis, then the system can be simple to manufacture, but the heat transfer efficiency and cooling performance deteriorate
Solution Approach 1:
The cooling channels are segmented into multiple transverse sections, each optimized for heat transfer from individual modules. This segmentation improves heat transfer efficiency by reducing thermal resistance paths while maintaining manufacturing simplicity through standardized channel geometries that can be produced using conventional techniques
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach achieves uniform and efficient cooling of electronic modules, reduces pumping energy requirements, and allows for a seamless transition from legacy coolers by maintaining the same form factor, enhancing performance and efficiency.
Implementation Method 1
an array of protrusions configured to transfer heat from a plurality of electronic modules to fluid flowing through the array of protrusions
Implementation Method 2
fluid flowing through the array of protrusions
Implementation Method 3
The distribution channel may be configured to direct fluid to simultaneously flow through the cooling channel in both the transverse direction and in an additional transverse direction substantially perpendicular to the longitudinal axis and substantially opposite the transverse direction
Data Source
AI summary
An illustrative cooler assembly may include an inlet, an outlet, a cooling channel, and a distribution channel. The cooling channel may include an array of protrusions configured to transfer heat from a plurality of electronic modules to fluid flowing through the array of protrusions. The plurality of electronic modules may be disposed along a longitudinal axis extending between the inlet and the outlet. The distribution channel may be in fluid communication with the cooling channel via a venting system. The distribution channel may be configured to direct fluid entering at the inlet to flow through the cooling channel in a transverse direction substantially perpendicular to the longitudinal axis before exiting at the outlet. Corresponding systems, assemblies, and methods are also disclosed.