Transverse Grounding Bar for Electrical Connector Resonance

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Solution Overview

Problem

Orthogonal type electrical connectors with long contacts often experience resonance effects due to their design, which existing solutions like double deck connectors with transverse grounding bars do not adequately address.

Innovation Solution

An electrical connector design featuring a pair of contact modules sandwiching a grounding module with a grounding plate and transverse grooves for grounding bars, which mechanically and electrically connect to the contact modules, reducing resonance through multiple contacting points.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the length of contacts is increased to achieve proper electrical connection, then the electrical connection capability is improved, but the resonance effect is worsened

Engineering Contradiction:
Improveelectrical connection capabilityVSAvoidresonance effect
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The grounding bar is divided into multiple segments (first grounding bar and second grounding bar) that are positioned at different locations along the contact wafer. This segmentation allows the grounding structure to counteract resonance at multiple points along the contact length, effectively reducing the resonance effect while maintaining proper electrical connection capability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The grounding bar acts as an intermediary element between the contact wafer and the housing. By providing a dedicated grounding path through the grounding bar that connects to the housing, the resonance energy is dissipated through this intermediary grounding structure, preventing the resonance from affecting the electrical connection performance.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If transverse grounding bars are added to reduce resonance effect, then the resonance effect is reduced, but the device complexity is increased

Engineering Contradiction:
Improveresonance effectVSAvoidconnector structure complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The grounding bar is merged with the contact wafer assembly such that the grounding bar is positioned between the contact wafer and the housing and works in conjunction with the existing contact structure. This merging approach allows the grounding function to be integrated into the existing connector design without requiring completely separate grounding components, thereby reducing the increase in device complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The grounding bar serves multiple functions: it provides a grounding path to reduce resonance, maintains mechanical spacing between the contact wafer and housing, and contributes to the overall structural integrity of the connector assembly. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS11081841B2Electrical connector haiving contact wafer equipped with transverse grounding bar
Publication Date: 2021.08.03 FOXCONN INTERCONNECT TECHNOLOGY LTD
  • US11081841B2 patent drawing
  • US11081841B2 patent drawing
  • US11081841B2 patent drawing

AI summary

An electrical connector includes an insulative housing defining a space. A connection module is received within the space. The connection module includes a pair of contact modules commonly sandwiching a grounding module therebetween in the transverse direction. Each contact module includes a plurality of contacts integrally formed within the corresponding insulative wafer via insert-molding. The grounding module includes a grounding plate embedded within an insulative wafer. The grounding plate forms a plurality of fingers respectively electrically and mechanically connecting to the corresponding grounding contacts of the contact modules. The wafer forms a plurality of transverse grooves to receive corresponding grounding bars each having a plurality of inward parts respectively mechanically and electrically connecting to the grounding plate, and a plurality of outward parts respectively mechanically and electrically connecting to the grounding contacts of the contact modules.