Transverse Lens Structure for Horizontal PIC Optical Coupling
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Solution Overview
Problem
Existing technologies face challenges in efficiently optically coupling photonic integrated circuit (PIC) chips with other devices, such as optical fibers or another PIC chip, due to limitations in providing effective horizontal signal communication.
Innovation Solution
The implementation of a transverse-oriented lens structure that is orthogonal to the PIC chip's edge-oriented lens structure, allowing for horizontal optical signal communication between the PIC chip's integrated edge-oriented couplers (IECs) and other devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conventional edge-oriented lens structure is used for optical coupling, then vertical optical communication is achieved, but horizontal signal communication between PIC chips and other devices is limited
Solution Approach 1:
The patent introduces a transverse-oriented lens structure that operates in a dimension orthogonal to the conventional edge-oriented lens structure. This dimensional transition enables horizontal optical signal communication while maintaining compatibility with existing vertical coupling architectures, effectively resolving the limitation without requiring complete system redesign
2Measurement precision
If optical coupling efficiency is improved through precise alignment, then coupling accuracy increases, but the profile height of the coupling structure increases
Solution Approach 1:
The patent employs transverse-oriented lens structures with curved surfaces that focus and collimate optical beams more effectively than flat interfaces. This curvature enables precise optical coupling with lower profile heights by achieving the necessary beam control within a compact vertical space, resolving the trade-off between coupling accuracy and structure height
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the ease, efficiency, and accuracy of optical coupling, while also providing a low-profile solution for communicating optical signals, facilitating beam expansion, mode conversion, and other functionalities.
Implementation Method 1
a lens structure which extends over a first region of the package substrate, the lens structure comprising a first divergent surface and a second surface on opposite respective sides of the lens structure
Data Source
AI summary
Techniques and mechanisms for facilitating horizontal communication with a photonic integrated circuit (PIC) chip, and a lens structure which is optically coupled thereto. In an embodiment, a PIC chip comprises integrated circuitry, photonic waveguides, and integrated edge-oriented couplers (IECs) which are coupled to the integrated circuitry via the photonic waveguides. The PIC chip forms respective first divergent lens surfaces of the IECs, which are each at a respective terminus of a corresponding one of the photonic waveguides. A lens structure, which is adjacent to the IECs, comprises a second divergent lens surface having an orientation which is substantially orthogonal to the respective orientations of the first divergent lens surfaces. In another embodiment, an edge of the PIC chip forms one or more recess structures, and the lens structure comprises one or more tenon portions which each extends into a respective recess structure of the one or more recess structures.