Byproduct Trap Bypass Switching for Semiconductor Exhaust Replacement
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Solution Overview
Problem
The existing semiconductor manufacturing processes face significant downtime and increased costs due to the need to stop the process chamber operation when the reaction by-product trapping apparatus becomes clogged, requiring extensive replacement and maintenance, which contaminates wafers and disrupts the production process.
Innovation Solution
A system that allows for rapid replacement of the trapping apparatus by diverting inert gas through a bypass pipe during the replacement process, maintaining the process chamber environment and resuming operation without stopping the semiconductor manufacturing process, using a direction switching valve, trapping apparatus, bypass pipe, and heating gate valve to manage gas flow paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the trapping apparatus operates continuously to trap reaction by-products, then the purification function is maintained, but the apparatus becomes clogged causing pressure increase and requiring shutdown for replacement
Solution Approach 1:
The trapping apparatus is divided into an upper trapping section and a lower trapping section that can be independently replaced. The quick release mechanism allows the upper section to be quickly detached and replaced without shutting down the entire system, thereby reducing downtime while maintaining continuous purification capability through the lower section.
Solution Approach 2:
A standby upper trapping section is prepared in advance and stored in a storage space. When the operating upper trapping section becomes clogged, the quick release mechanism enables rapid replacement with the pre-prepared standby section, eliminating the need for time-consuming cleanup procedures and reducing replacement downtime.
2Ease of repair
If the process chamber operation is stopped to replace the trapping apparatus, then the clogged apparatus can be replaced, but wafer contamination occurs and production is disrupted
Solution Approach 1:
A standby upper trapping section is prepared in advance and stored in a storage space. When the operating upper trapping section becomes clogged, the quick release mechanism enables rapid replacement with the pre-prepared standby section, eliminating the need for time-consuming cleanup procedures and reducing replacement downtime.
Solution Approach 2:
The upper trapping section is designed as a separable component that can be quickly extracted from the system using the quick release mechanism. This allows the clogged section to be removed and replaced without affecting the lower trapping section, which continues to operate and protect the process chamber, thereby preventing wafer contamination.
3Reliability
If the trapping apparatus is replaced frequently due to clogging, then the purification efficiency is maintained, but the production cost increases
Solution Approach 1:
The trapping apparatus is divided into an upper trapping section and a lower trapping section that can be independently replaced. The quick release mechanism allows the upper section to be quickly detached and replaced without shutting down the entire system, thereby reducing downtime while maintaining continuous purification capability through the lower section.
Solution Approach 2:
A standby upper trapping section is prepared in advance and stored in a storage space. When the operating upper trapping section becomes clogged, the quick release mechanism enables rapid replacement with the pre-prepared standby section, eliminating the need for time-consuming cleanup procedures and reducing replacement downtime.
4Duration of action of stationary object
If the trapping apparatus capacity is increased to reduce replacement frequency, then the operating time is extended, but the apparatus size and complexity increase
Solution Approach 1:
The trapping apparatus is divided into an upper trapping section and a lower trapping section that can be independently replaced. The quick release mechanism allows the upper section to be quickly detached and replaced without shutting down the entire system, thereby reducing downtime while maintaining continuous purification capability through the lower section.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables continuous semiconductor production with reduced downtime by quickly replacing the trapping apparatus, maintaining the process environment, and resuming operations within three hours, thereby improving productivity and reducing semiconductor production costs.
Implementation Method 1
a heating gate valve configured to receive any one of the exhaust gas and the inert gas from the trapping apparatus while performing an opening/closing operation and configured to supply any one of the exhaust gas and the inert gas to the exhaust pipe connected to a vacuum pump at a rear end or cut off the supply of any one of the exhaust gas and the inert gas
Data Source
AI summary
Disclosed is a process stop loss reduction system, in which in case that pressure in a trapping apparatus and pressure in a process chamber are increased because of space clogging or the like caused by reaction by-products while the trapping apparatus for trapping of a reaction by-product contained in exhaust gas discharged from the process chamber operates over a long period of time during a semiconductor process, only the trapping apparatus, to which a supply of exhaust gas is cut off, may be quickly replaced while inert gas is received in an idle state and continuously supplied to a vacuum pump through a bypass pipe of the trapping apparatus without stopping an operation of (shutting down) a semiconductor manufacturing process chamber facility, and then the trapping apparatus may be supplied with the exhaust gas again.