Right Trapezoidal Silicon Photonic Waveguide for Signal Loss Reduction
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Solution Overview
Problem
Existing silicon photonic packages experience significant optical signal loss due to diffuse reflection and inadequate heat dissipation, particularly when using straight-line optical paths on PCB substrates or thin silica waveguides, which are not suitable for direct coupling with photonic chips.
Innovation Solution
A silicon photonic package design featuring a right trapezoidal optical waveguide structure with a low-reflectivity coating, embedded in a plastic encapsulation layer with a heat dissipation structure, allowing for reduced signal loss and improved heat management through total reflection and conductive pathways, enabling direct optical signal processing and efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a straight-line optical path is formed in a polymer material on a PCB substrate, then the optical signal can be transmitted from the optical fiber to the photonic chip, but significant optical signal loss occurs due to diffuse reflection around the output end
Solution Approach 1:
The optical path is transformed from a straight-line configuration to a three-dimensional structure by introducing a vertical dimension. The optical waveguide extends upward from the PCB substrate, and the reflective surface is positioned at the bottom to reflect light upward, changing the propagation path from horizontal to vertical and eliminating the need for right-angle extensions that cause reflection losses.
Solution Approach 2:
A reflective surface is introduced as an intermediary element between the optical waveguide and the photonic chip. This reflective surface redirects the optical signal that would otherwise be lost through diffuse reflection, channeling it properly toward the photonic chip input end and reducing signal loss.
2Loss of energy
If a thin silica film is formed as an optical waveguide structure on a silicon substrate, then the optical waveguide structure can be formed, but the thin silica film suffers from even more significant optical signal loss and cannot directly process optical signals from the optical fiber
Solution Approach 1:
The optical waveguide structure uses composite materials consisting of silica as the core material and silicon as the cladding material. This composite structure leverages the optical properties of both materials: silica provides low optical loss transmission, while silicon provides mechanical support and can be integrated with photonic chips. The different refractive indices between silica and silicon create the waveguide effect, enabling efficient optical signal transmission.
3Reliability
If the optical waveguide structure is coupled to the photonic chip, then optical signal transmission is achieved, but heat dissipation becomes insufficient leading to temperature rise
Solution Approach 1:
The heat dissipation structure is merged with the optical waveguide structure, forming an integrated assembly. The heat dissipation structure, positioned adjacent to the optical waveguide, provides thermal management for the entire optical transmission system, allowing simultaneous achievement of reliable optical signal transmission and effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly reduces optical signal loss and enhances heat dissipation, allowing for a compact package with improved spatial utilization and reduced propagation loss, enabling efficient optical signal transmission to photonic chips.
Implementation Method 1
the second leg disposed on a totally reflecting surface capable of totally reflecting an optical signal that enters the optical waveguide structure from a surface where the first leg is disposed in a direction parallel to the front face to a plane where the first base is disposed
Data Source
AI summary
A silicon photonic package and a method of fabricating the package are disclosed. The silicon photonic package includes an optical waveguide structure, a heat dissipation structure, a plastic encapsulation layer, first and second structures. The optical waveguide structure is a right trapezoidal structure, and a surface where a non-right angle leg thereof is a totally reflecting surface capable of totally reflecting an optical signal that enters the optical waveguide structure from a surface where a right angle leg is disposed in a direction parallel to bases to a plane where a front face of the plastic encapsulation layer is disposed. The heat dissipation structure and the optical waveguide structure are spaced apart from each other and both embedded in the plastic encapsulation layer. The optical waveguide structure of the present invention allows a great reduction in loss of an optical signal incurred by its propagation in the optical waveguide structure.