Trapezoidal Via Substrates for LED Fluidic Assembly Retention

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Solution Overview

Problem

LED devices tend to dislodge from wells during fluidic assembly in LED display manufacturing due to the stochastic nature of the deposition process, leading to insufficient population of displays.

Innovation Solution

Substrates with trapezoidal cylinder shaped through holes extending from the bottom of well structures are used, which allow for a suction force to secure LED devices in place by enlarging the opening at the bottom surface, preventing dislodgment during the assembly process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If LED devices are deposited into wells using fluidic assembly, then assembly speed is improved, but device stability deteriorates due to dislodgment

Engineering Contradiction:

Improveassembly speedVSAvoiddevice stability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The through-hole via structure is prepared in advance within the well, creating a pre-formed anchoring pathway that will capture and secure the LED device during fluidic deposition. This preliminary structural preparation enables the well to automatically retain devices without requiring additional securing steps after deposition.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The LED device is nested within the well structure, and the through-hole via extends from the well bottom through the substrate, creating a nested configuration where the device is captured within the well and anchored by the via structure, preventing dislodgment during fluidic assembly.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Reliability

If through hole vias are made with small opening at top surface, then device retention is improved, but filling difficulty increases

Engineering Contradiction:

Improvedevice retentionVSAvoidvia filling difficulty

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The via geometry is designed with specific dimensional parameters: a smaller opening at the top surface (within the well) for retention, and a larger opening at the bottom surface (through the substrate) for easier filling. This parameter variation along the via length optimizes both device retention and manufacturability.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The through-hole via exhibits asymmetric geometry with different opening sizes at its two ends - a smaller opening at the top surface within the well for device retention, and a larger opening at the bottom surface extending through the substrate for easier material filling and device anchoring.

Inventive Principle:

Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The trapezoidal cylinder shaped through holes effectively secure LED devices within wells, ensuring proper deposition and retention during fluidic assembly, enhancing the efficiency of LED display manufacturing by preventing dislodgment and ensuring complete population of displays.

Implementation Method 1

which allow for a suction force to secure LED devices in place by enlarging the opening at the bottom surface

Methodology Applied

Scientific EffectSuction force: Suction

Data Source

PatentUS10879182B2Assembly substrates including through hole vias and methods for making such

Publication Date: 2020.12.29 CORNING INC

AI summary

Various embodiments are related to substrates having one or more well structures with a trapezoidal cylinder shaped through hole via extending from the bottom of the well structure though the substrate.