Substrate Tray Alignment Sensing for Supercritical Drying
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Solution Overview
Problem
Conventional substrate processing apparatuses using supercritical fluids face issues with tray tilting or offset during processing, leading to uneven fluid flow and pattern collapse due to imbalanced capillary forces, which can damage ultrafine patterns on semiconductor wafers.
Innovation Solution
A substrate processing apparatus equipped with detection sensors to align and correct the position of the tray within the chamber, using first, second, and third detection sensors to monitor tilting or offset along the X and Y axes, ensuring uniform fluid flow and preventing pattern damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the tray is not fixed at both ends to allow movement, then the substrate processing flexibility is improved, but the tray tilts or offsets during processing causing pattern collapse
Solution Approach 1:
The patent employs detection sensors that continuously monitor the tray's position and tilt during processing. When deviation is detected, the system provides feedback to actuators that adjust the tray's position, creating a closed-loop control system that maintains precision while allowing tray movement flexibility
Solution Approach 2:
The tray positioning system transitions from a static fixed structure to a dynamic adjustable structure. The tray can be actively positioned and tilted at different stages of processing, allowing optimization for both flexibility and precision requirements at different moments
2Manufacturing precision
If detection sensors are added to monitor tray position, then the manufacturing precision is improved, but the device complexity increases
Solution Approach 1:
The patent replaces complex mechanical alignment mechanisms with detection sensors and control systems. Instead of using elaborate mechanical structures to physically ensure precise tray positioning, the system uses sensors to detect position and electronically controls adjustment, simplifying the overall mechanical complexity
3Manufacturing precision
If the tray is fixed rigidly to prevent tilting, then the manufacturing precision is improved, but the ease of operation deteriorates
Solution Approach 1:
The tray system is designed to be dynamically adjustable rather than statically fixed. During loading and setup phases, the tray can be easily positioned and adjusted. During the actual processing phase, the system actively maintains precision through detection and control, providing both ease of operation and positional stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures proper alignment of the tray, maintaining uniform fluid flow and preventing pattern collapse during supercritical fluid processing, thereby protecting ultrafine patterns on semiconductor wafers.
Implementation Method 1
a detection sensor configured to detect tilting or offet of the tray, wherein the detection sensor includes at least one of a first detection sensor configured to detect tilting of the tray based on a first axis (X axis) parallel to a horizontal plane, a second detection sensor configured to detect tilting of the tray based on a second axis (Y axis) parallel to the horizontal plane, and a third detection sensor configured to detect movement of the tray in the direction of the first axis (X axis)
Implementation Method 2
when a fluid is dried through a supercritical state by using both temperature and pressure control of the fluid, a gas-liquid equilibrium line is not passed, and thus it is possible to dry a substrate in a state essentially free of capillary force
Implementation Method 3
The capillary force causing the pattern collapse described above is caused by an atmospheric atmosphere surrounding the substrate S after cleaning and a surface tension of the treatment liquid functioning at a liquid/gas interface with the treatment liquid remaining between patterns
Data Source
AI summary
The present disclosure relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus for detecting tilting or offset of a tray supporting a substrate when a processing process such as a drying process for a substrate using supercritical fluid.