Electronic Component Tray Pocket Structure for Substrate Edge Protection

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Solution Overview

Problem

Tray structures for transporting electronic components often cause damage to substrates due to loose-fitting pockets that allow movement, leading to chip-off and scratches at the substrate's edge portions.

Innovation Solution

The tray structure design includes captures and support portions that form a receiving space, where captures contact side surfaces above the lower edge and the support portion contacts the bottom surface without touching the outer edge, preventing damage during movement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the pocket is designed to be slightly larger than the component to accommodate manufacturing tolerances, then the component can be easily inserted and manufacturing variability is tolerated, but the component can move freely within the pocket causing chip-off and scratches on the substrate edge

Engineering Contradiction:
Improvetolerance accommodationVSAvoidsubstrate edge damage
Core Design Contradiction:
Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

The pocket is segmented into distinct functional zones: a capture portion with inner walls that contact and restrain the substrate body, and a support portion with a support contact surface that contacts only the central region of the substrate bottom. This segmentation allows the pocket to simultaneously accommodate manufacturing tolerances through the support portion while preventing edge damage through the capture portion's restraint mechanism

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the pocket are given different geometric properties tailored to their specific functions. The capture portion features vertical or inclined inner walls positioned to contact the substrate body without reaching the edge, while the support portion has a support contact surface positioned centrally to provide stable support. This local differentiation enables the pocket to achieve both tolerance accommodation and edge protection

Inventive Principle:
Principle #3Local quality

2Stability of the object's composition

If the inner wall of the capture intersects with and connects to the support contact surface to surround the substrate edge, then the substrate is firmly restrained, but the delicate outer edge portion of the substrate comes into contact with the lower edge portion of the inner wall causing chip-off and scratches

Engineering Contradiction:
Improvesubstrate restraintVSAvoidsubstrate edge damage
Core Design Contradiction:
Stability of the object's compositionVSObject-affected harmful factors

Solution Approach 1:

The potentially harmful lower edge portion of the inner wall is extracted or removed from the design. Instead of the inner wall extending down to contact the substrate edge, the support contact surface of the support portion is positioned to contact only the central region of the substrate bottom, creating a gap that prevents the inner wall's lower edge from intersecting with the support contact surface and contacting the substrate edge

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The support portion acts as an intermediary element between the capture portion and the substrate. The support contact surface contacts the central region of the substrate bottom, providing stable support and restraint without allowing the capture portion's inner wall to directly contact the substrate edge. This intermediary structure enables firm restraint while protecting the edge

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS20260075788A1Tray system for electronic components and tray structure thereof
Publication Date: 2026.03.12 ILLINOIS TOOL WORKS INC
  • US20260075788A1 patent drawing
  • US20260075788A1 patent drawing
  • US20260075788A1 patent drawing

AI summary

The present disclosure provides a tray structure comprising one or more pockets, each pocket configured to receive a package assembly having a substrate or to receive a substrate, each pocket comprising: a plurality of captures configured to be in contact with side surfaces of the substrate; and a support portion configured to support the substrate, wherein the captures and the support portion form a receiving space to receive at least a part of the substrate, the captures are configured to be in contact with parts of the side surfaces of the substrate above lower edge portions thereof, and the support portion is configured to be in contact with a part of a bottom surface of the substrate but not in contact with an outer edge portion of the bottom surface of the substrate.