Treatment Liquid Mixing Control for Uniform Substrate Temperature
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Solution Overview
Problem
Existing substrate treatment technologies face challenges in efficiently controlling the temperature of treatment liquids and ensuring uniformity, particularly in varying environmental conditions, without the use of separate heaters.
Innovation Solution
A substrate treating apparatus and method that utilize a combination of high-temperature and room-temperature DIW supply lines, along with a control unit that adjusts the flow rates of these liquids based on measured substrate and treatment liquid temperatures, to maintain precise temperature control and uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a separate heater is used to control treatment liquid temperature, then temperature control capability is improved, but device complexity increases
Solution Approach 1:
The patent merges the temperature control function into the existing liquid supply system by mixing DIW at different temperatures. Instead of adding a separate heater, the system combines first DIW (from first DIW supply line) and second DIW (from second DIW supply line) through a mixer, integrating temperature regulation into the flow distribution architecture already present in the apparatus.
Solution Approach 2:
The patent introduces DIW at different temperatures as an intermediary medium to achieve temperature control. By using pre-heated or cooled DIW from separate supply lines as mediators, the system can adjust treatment liquid temperature through mixing ratios controlled by flow rate controllers, avoiding direct heating elements.
2Device complexity
If temperature control is implemented without separate heaters, then device complexity is reduced, but temperature control precision may worsen
Solution Approach 1:
The patent implements feedback control by using temperature sensors to detect the actual temperature of the treatment liquid and adjusting the flow rates of first and second DIW accordingly. The controller receives temperature feedback and dynamically modifies the mixing ratio to maintain the desired temperature setpoint, ensuring precise temperature control despite environmental variations.
Solution Approach 2:
The patent employs dynamic flow rate adjustment of the first and second DIW supply lines based on real-time temperature conditions. The flow rate controllers continuously adapt the mixing ratio in response to changing environmental temperatures or substrate temperature requirements, enabling flexible and precise temperature control without fixed heating elements.
3Manufacturing precision
If uniform temperature distribution is achieved across substrate, then treatment uniformity is improved, but control complexity increases
Solution Approach 1:
The patent segments the DIW supply into multiple temperature zones by providing separate first and second DIW supply lines with different temperatures. Each supply line can be independently controlled to deliver specific temperature components to different regions or at different times, enabling precise spatial and temporal temperature distribution across the substrate surface through the mixing system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for efficient temperature regulation of treatment liquids, enhancing temperature reliability and uniformity on substrates, even in changing environmental conditions, without the need for separate heaters.
Implementation Method 1
a first DIW supply line that is connected to the main supply line and that supplies DIW at a first temperature, a second DIW supply line that is connected to the main supply line and that supplies DIW at a second temperature higher than the first temperature
Data Source
AI summary
Disclosed is an apparatus for treating a substrate. The apparatus includes a substrate support unit that supports the substrate, a nozzle unit that dispenses a treatment liquid onto the substrate supported on the substrate support unit, and a liquid supply unit that supplies the treatment liquid to the nozzle unit. The liquid supply unit includes a main supply line that is connected to the nozzle unit and that supplies the treatment liquid to the nozzle unit, wherein the treatment liquid is prepared by mixing a chemical with DIW at a first temperature and DIW at a second temperature higher than the first temperature, and temperature of the treatment liquid is adjusted by regulating a flow rate of the DIW at the first temperature and a flow rate of the DIW at the second temperature without a separate heater.