Tree-Shaped PCB Assembly for High LED Density

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional LED circuit boards have a wasteful and expensive configuration due to LEDs being spaced far apart, leading to underutilization of the PCB substrate, and there is a need for a low-density LED arrangement over a large area while maintaining low costs.

Innovation Solution

The solution involves manufacturing a printed circuit board with a 'tree' shape, including a center portion and side portions extending outward, allowing multiple PCB subassemblies to be interlaced and coupled together, thereby increasing the number of LEDs in a given area while minimizing substrate usage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of substance

If LEDs are spaced far apart on conventional PCB subassemblies, then each LED has sufficient mounting space and electrical connections, but the PCB substrate is underutilized and material costs increase

Engineering Contradiction:
ImprovePCB substrate usage efficiencyVSAvoidNumber of LEDs per unit area
Core Design Contradiction:
Loss of substanceVSQuantity of substance

Solution Approach 1:

The invention divides the conventional square PCB assembly into four separate tree-shaped PCB subassemblies, each with its own center portion and side portions. This segmentation allows each subassembly to be optimized for LED placement while maintaining electrical connectivity through the interlacing configuration, thereby increasing substrate utilization efficiency without compromising LED spacing requirements.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The four tree-shaped PCB subassemblies are nested or interlaced together in a compact arrangement where the side portions of each subassembly interface with adjacent subassemblies. This nesting approach maximizes the density of LEDs within the overall assembly footprint while ensuring that each LED maintains adequate spacing for mounting and electrical connections on its respective substrate.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Quantity of substance

If multiple PCB subassemblies are interlaced together, then more LEDs can be packed in a given area, but the manufacturing complexity increases

Engineering Contradiction:
ImproveNumber of LEDs per assemblyVSAvoidPCB assembly structure
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

The invention employs asymmetric tree-shaped PCB subassemblies with distinct center and side portions rather than symmetric square configurations. This asymmetry enables the side portions to interlace with adjacent subassemblies in a straightforward manner, reducing manufacturing complexity compared to attempting to interlace symmetric square assemblies while achieving higher LED density.

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The four separate tree-shaped PCB subassemblies are merged or coupled together through their side portions to form a single integrated LED assembly. This merging process consolidates multiple LED arrays into one functional unit with improved substrate utilization, while the modular tree-shaped design simplifies the coupling process compared to reconfiguring entire square assemblies.

Inventive Principle:
Principle #5Merging (Combining)

3Quantity of substance

If LEDs are spaced closer together, then more LEDs fit in the same area, but electrical connections and heat dissipation become more difficult

Engineering Contradiction:
ImproveLED densityVSAvoidElectrical connection reliability
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The invention applies local quality by providing dedicated center portions on each tree-shaped PCB subassembly where LEDs are mounted with optimal spacing for electrical connections and heat dissipation. The side portions are designed specifically for interlacing with adjacent subassemblies, allowing the assembly to achieve high overall LED density while maintaining reliable electrical connections and thermal management at each local LED mounting location.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS10477685B2Light-emitting diode circuit board
Publication Date: 2019.11.12 HUBBELL LIGHTING INC
  • US10477685B2 patent drawing
  • US10477685B2 patent drawing
  • US10477685B2 patent drawing

AI summary

A method of manufacturing a printed circuit board with a plurality of light-emitting diodes (LEDs). The method including providing a printed circuit board having a center portion, a first side portion extending outwardly from the center portion in a first direction, and a second side portion extending outwardly from the center portion in a second direction opposite the first direction; and electrically populating LEDs along the center portion, the first side portion, and the second side portion.