Trench Capacitor Structure for High Density and Strength
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Solution Overview
Problem
There is a need for capacitors that are smaller and thinner to accommodate the downsizing of communication equipment while maintaining capacitance density, and existing technologies struggle to achieve this without compromising mechanical strength or increasing manufacturing costs.
Innovation Solution
The design incorporates a conductive substrate with recesses on both main surfaces, a conductive layer covering these recesses, and a dielectric layer in between, along with external electrodes, to create a trench capacitor structure that increases surface area and capacitance without excessive thickness, using a manufacturing process that forms through holes at the intersections of the recesses to enhance electrical connection and mechanical integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a trench capacitor structure is used to increase surface area and capacitance density, then the capacitor becomes smaller and thinner, but the mechanical strength may be compromised due to the recesses in the substrate
Solution Approach 1:
The substrate is divided into multiple regions with recesses formed at specific locations, creating segmented conductive paths that maintain structural integrity while increasing capacitance density. The recesses are strategically positioned to avoid compromising overall mechanical strength.
Solution Approach 2:
The conductive layer is nested within the recesses of the substrate, creating a multi-level structure where the conductive material fills the凹陷 regions. This nesting approach increases the effective surface area for capacitance without significantly increasing the overall footprint or compromising substrate strength.
2Length of stationary object
If the capacitor thickness is reduced to meet downsizing requirements, then the mounting area is reduced, but the manufacturing precision requirements increase to maintain capacitance density
Solution Approach 1:
Instead of increasing capacitance solely by increasing thickness, the invention transitions to a two-dimensional approach by forming recesses on the substrate surface. This increases the effective surface area for the conductive layer, allowing capacitance density improvement without increasing overall thickness, thereby reducing demands on manufacturing precision for thickness control.
3Quantity of substance
If the surface area is increased through recesses to improve capacitance density, then the manufacturing process becomes more complex, but the capacitance per mounting area increases
Solution Approach 1:
Rather than uniformly increasing surface area across the entire substrate, recesses are formed only at specific local regions where they are most effective for increasing capacitance density. This localized approach increases capacitance while minimizing the added structural complexity and manufacturing steps.
Data Source
AI summary
According to one embodiment, a capacitor includes a conductive substrate, a conductive layer, a dielectric layer, and first and second external electrodes. The conductive substrate has a first main surface provided with recess(s), a second main surface, and an end face extending between edges of the first and second main surfaces. The conductive layer covers the first main surface and side walls and bottom surfaces of the recess(s). The dielectric layer is interposed between the conductive substrate and the conductive layer. The first external electrode includes a first electrode portion facing the end face and is electrically connected to the conductive layer. The second external electrode includes a second electrode portion facing the end face and is electrically connected to the conductive substrate.