Trench Capacitor Package Interposer With Front-Side Protection Layer

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Solution Overview

Problem

There is an ongoing need for better performing packages with reduced size, particularly in the integration of trench capacitor devices, where improved joint connections and protection of components are required to enhance performance and reliability.

Innovation Solution

A package comprising a first integrated device, a package interposer, and a passive device with a passive device substrate containing trench capacitors and through substrate vias, protected by a protection layer such as an encapsulation or polymer dielectric layer, which enhances joint connections and protects interconnects during handling and fabrication.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If trench capacitor devices are integrated into the package interposer, then the package performance is improved and size is reduced, but the joint connections and component protection requirements increase complexity

Engineering Contradiction:

Improvepackage performanceVSAvoidjoint connection complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by forming the protection layer over the trench capacitor devices and interconnect structures before final package assembly. This pre-formed protection layer simplifies subsequent handling and assembly operations, as the delicate interconnect structures are already protected during the packaging process, reducing the complexity of joint connections.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The protection layer acts as an intermediary element between the trench capacitor devices/interconnects and the external environment. This intermediate layer provides mechanical protection and electrical insulation, simplifying the joint connection process by providing a stable, protected interface for subsequent bonding operations.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Volume of moving object

If the package size is reduced through trench capacitor integration, then space efficiency improves, but the protection of interconnects during handling becomes more critical

Engineering Contradiction:

Improvepackage sizeVSAvoidinterconnect protection

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The patent implements beforehand cushioning by forming a protection layer that encapsulates the interconnect structures and trench capacitor devices before package assembly. This pre-formed protective cushioning layer prevents mechanical damage to the interconnects during handling and assembly operations, maintaining reliability in the compact package design.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The protection layer functions as a flexible protective shell or thin film that conforms to the three-dimensional structure of the trench capacitors and interconnects. This thin film protection provides mechanical strength and damage resistance while occupying minimal space, enabling compact package design without compromising interconnect protection.

Inventive Principle:

Principle #30Flexible shells and thin films

3Reliability

If a protection layer is added to the passive device, then joint connections and signal integrity improve, but the device complexity increases

Engineering Contradiction:

Improvejoint connection reliabilityVSAvoidpassive device structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The protection layer performs multiple functions simultaneously: it provides mechanical protection to the underlying structures, electrical insulation for signal integrity, and a preparation layer for subsequent bonding operations. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity while improving joint connection reliability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

4Quantity of substance

If trench capacitors are located in the passive device substrate, then capacitance density increases, but the manufacturing precision requirements increase

Engineering Contradiction:

Improvecapacitance densityVSAvoidtrench formation precision

Core Design Contradiction:

Quantity of substanceVSManufacturing precision

Solution Approach 1:

The protection layer is formed over the trench capacitor structures before final assembly, providing a stable platform that compensates for minor variations in trench formation precision. This preliminary protective layer ensures that subsequent bonding and assembly operations can proceed with relaxed precision requirements, as the protection layer absorbs minor dimensional variations.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS20250357448A1Package comprising a passive device with a front side protection layer

Publication Date: 2025.11.20 QUALCOMM INC

AI summary

A package comprising a first integrated device; a package interposer coupled to the first integrated device; and a passive device located at least partially in the package interposer. The passive device comprises a passive device substrate; a plurality of trench capacitors located at least partially in the passive device substrate; a plurality of through substrate vias extending through the passive device substrate; and a protection layer that is part of a first surface of the passive device, wherein the protection layer comprises an encapsulation layer or a polymer dielectric layer.