Trench-Integrated SiPh and TF-LN Chip Butt Coupling
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Solution Overview
Problem
The high-precision alignment required for optical integrated devices with TF-LN optical waveguides increases the workload due to their small optical mode field diameter and electro-optic effects, making the mounting process challenging and inefficient.
Innovation Solution
The integration of a SiPh chip with a TF-LN chip using a trench structure on the TF-LN chip, allowing for face-down mounting and butt coupling, which reduces the number of components needed and simplifies the alignment process by utilizing a larger electro-optic effect material, thereby reducing the size and complexity of the TF-LN chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If high-precision alignment is performed for TF-LN optical waveguides, then optical coupling efficiency is improved, but mounting workload and complexity increase
Solution Approach 1:
The device is divided into two separate chips: a first chip containing the optical circuit and a second chip containing the TF-LN optical waveguide. This segmentation allows each chip to be optimized independently, reducing the overall mounting complexity while maintaining alignment precision through the trench structure
Solution Approach 2:
A trench structure is introduced as an intermediary element between the two chips. The trench provides a predefined alignment reference and mechanical support, enabling precise optical coupling without requiring complex alignment procedures during mounting
2Reliability
If TF-LN optical waveguide with electro-optic effect is used, then optical modulation performance is improved, but alignment difficulty increases due to small mode field diameter
Solution Approach 1:
The trench structure serves as an intermediary alignment aid that compensates for the small mode field diameter of the TF-LN waveguide. By providing mechanical and optical references at the chip level, the trench enables accurate alignment without requiring direct visualization or measurement of the small mode field
Solution Approach 2:
The trench structure is pre-formed on the TF-LN chip before mounting. This preliminary action creates built-in alignment references that guide the positioning of the first chip, eliminating the need for complex real-time alignment procedures during the mounting process
3Adaptability or versatility
If multiple separate components are used for optical coupling, then optical functionality is achieved, but device size and component count increase
Solution Approach 1:
The optical coupling function is merged directly into the chip structure through the trench formation. Instead of using separate alignment fixtures, mounting fixtures, or intermediate components, the trench itself provides both mechanical support and optical alignment, eliminating multiple separate components while maintaining full optical functionality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the workload for mounting, minimizes waste, and allows for a more efficient optical coupling with reduced coupling loss, while also enabling a smaller optical circuit design and lower drive voltage requirements.
Implementation Method 1
The optical modulator 112 has an optical waveguide and an electrode that applies an electrical signal to the optical waveguide, and optically modulates light passing through the optical waveguide by applying the electrical signal from the electrode
Implementation Method 2
The first chip is optically coupled to the second chip by butt coupling
Data Source
AI summary
An optical integrated device includes a first chip including an optical circuit, and a second chip including an optical waveguide including a material with an electro-optic effect larger than the electro-optic effect of a material of the first chip. In the optical integrated device, the first chip is mounted in a trench formed on the second chip, and the first chip is optically coupled to the second chip by butt coupling.