Trench Isolation Routing Electrodes for Dense Semiconductor Interconnects
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Solution Overview
Problem
The challenge of connecting multiple semiconductor devices among circuits becomes increasingly complex and costly as more stacks of circuits are interconnected, particularly due to the need for additional metal routing paths which can interfere with device performance and increase parasitic capacitances.
Innovation Solution
A routing electrode layer is deposited in the recess of trench isolations to facilitate chip-level metal routing, allowing for additional interconnection areas without interfering with active device regions, and can be integrated with planar or 3D transistors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If additional metal routing paths are used to connect multiple semiconductor devices, then interconnection capability is improved, but parasitic capacitances increase and device performance deteriorates
Solution Approach 1:
The patent utilizes the vertical dimension by forming routing electrode layers within recesses of trench isolation structures. Instead of adding more horizontal metal routing layers, the invention creates conductive paths by etching recesses into the trench isolation and filling them with routing electrodes, thereby achieving additional interconnection capability in the vertical dimension without increasing parasitic capacitances from additional planar metal layers
2Productivity
If more stacks of circuits are interconnected, then circuit integration is improved, but fabrication complexity and cost increase
Solution Approach 1:
The patent combines the formation of routing electrodes with the existing trench isolation fabrication process. The routing electrode layer is formed within the trench isolation recesses using the same etching and filling steps already required for isolation structures, thereby integrating additional interconnection functionality without proportionally increasing fabrication complexity or cost
3Adaptability or versatility
If metal routing paths are added to connect multiple devices, then interconnection capability is improved, but manufacturing cost increases
Solution Approach 1:
The trench isolation structure serves multiple functions: it provides electrical isolation between devices and simultaneously houses the routing electrode layers for interconnection. This multi-functionality allows the same structural element to deliver both isolation and routing capabilities, avoiding the need for separate dedicated routing structures and thereby reducing manufacturing cost while maintaining improved interconnection capability
Data Source
AI summary
In certain aspects, a semiconductor device includes a substrate, a first trench isolation in the substrate, a second trench isolation in the substrate and surrounding a portion of the substrate, and a first routing electrode layer extending through the first trench isolation. The portion of the substrate is an active region of a transistor.