Trench-Like Optoelectronic Component With Linear Chip Array
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing optoelectronic components with single semiconductor chips are inadequate for applications requiring high luminance and narrow radiation angles, as they limit the compact arrangement of chips and increase manufacturing costs due to the need for multiple components and complex electrical connections.
Innovation Solution
An optoelectronic component with a trench-like housing cavity containing multiple semiconductor chips arranged linearly, where neighboring chips are closely spaced to achieve a narrow radiation cone with high luminance, and a reflective screening wall to control radiation emission, along with an optical element to reduce divergence and a luminescence conversion element for white light generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If multiple semiconductor chips are arranged in a matrix array to increase luminance, then the total light output is improved, but the component size and manufacturing complexity increase due to individual housing and electrical connections for each chip
Solution Approach 1:
Multiple semiconductor chips are integrated into a single housing body with a common cavity, eliminating the need for individual housings and simplifying electrical connections. The chips are arranged in a linear array on a lead frame, sharing common electrical connection paths, which reduces manufacturing complexity while maintaining high luminance output.
Solution Approach 2:
The semiconductor chips are arranged in a linear one-dimensional array within the housing cavity rather than a two-dimensional matrix. This linear arrangement reduces the spatial footprint and simplifies the structural design while still achieving the required luminance through the cumulative effect of multiple chips.
2Illumination intensity
If individual components with single chips are used to achieve high luminance, then the radiation characteristic can be controlled, but the space requirement and manufacturing cost increase
Solution Approach 1:
Multiple semiconductor chips are combined within a single housing body, reducing the total number of components and the space required for installation. The shared housing and common electrical connections minimize the overall footprint while achieving high luminance through the aggregated light output of multiple chips.
Solution Approach 2:
The linear arrangement of chips in one dimension allows for compact packaging within the housing cavity, optimizing the use of available space. This arrangement achieves high luminance without requiring the larger two-dimensional matrix configuration, thereby reducing the overall space requirement.
3Ease of manufacture
If semiconductor chips are arranged with larger spacing for ease of manufacturing, then the manufacturing process is simplified, but the radiation cone becomes less homogeneous and the solid angle increases
Solution Approach 1:
The distance between adjacent semiconductor chips is optimized to be less than or equal to 1.5 times the lateral edge length of the chips. This parameter optimization achieves a balance between manufacturing feasibility and radiation homogeneity, allowing for compact chip spacing that produces a narrow, homogeneous radiation cone while remaining manufacturable.
4Illumination intensity
If multiple individual components are used to achieve high luminance, then the light output is sufficient, but the electrical connection complexity and manufacturing cost increase
Solution Approach 1:
Multiple semiconductor chips are electrically connected in parallel within the single housing body, sharing common electrical connection paths through the lead frame. This eliminates the need for separate electrical connections for each individual component, significantly reducing the complexity of electrical wiring and manufacturing costs while maintaining high luminance output.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables a compact, high-intensity, and homogeneous radiation pattern suitable for headlamp applications, effectively projecting radiation onto a small area with a narrow solid angle, while reducing manufacturing complexity and costs.
Implementation Method 1
a reflective screening wall to control radiation emission
Implementation Method 2
an optical element to reduce divergence
Implementation Method 3
a luminescence conversion element for white light generation
Data Source
AI summary
An optoelectronic component emitting electromagnetic radiation, comprising a housing body which has a cavity, the cavity being fashioned trenchlike and in the cavity a plurality of semiconductor chips being arranged in a linear arrangement. Two neighboring semiconductor chips have a distance from one another which is less than or equal to one-and-a-half lateral edge lengths of the semiconductor chips and greater than or equal to 0 μm. In addition, an illumination module comprising such a component is disclosed.