Trenched-Bonding-Dam Device for Adhesive Bleeding Control

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Adhesive bonding in 3-D assembly of electronic devices often results in adhesive bleeding, leading to unintended bonding, physical blockage, and impaired device operation, necessitating increased component sizes to accommodate bleeding, which increases manufacturing costs and reduces efficiency.

Innovation Solution

The use of a trenched-bonding-dam device with a bonding dam structure featuring inner and outer dams and a trench to contain excess adhesive, allowing for precise alignment and bonding of optics systems with substrates, thereby inhibiting lateral adhesive bleeding and enabling adjustment of focal length during assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If adhesive bonding is used in 3-D assembly, then components can be joined together, but adhesive bleeding occurs leading to unintended bonding and physical blockage

Engineering Contradiction:
Improvebonding strengthVSAvoidadhesive bleeding
Core Design Contradiction:
StrengthVSObject-generated harmful factors

Solution Approach 1:

The bonding dam structure is segmented into inner and outer dams with a trench between them, creating distinct zones for adhesive containment. This segmentation allows the adhesive to be confined within specific regions, preventing lateral bleeding while maintaining bonding strength between substrates and optics systems.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The bonding dam structure acts as an intermediary element between the adhesive and the substrates/optics systems. It mediates the adhesive bonding process by providing a controlled path for adhesive flow and containing it within desired boundaries, thereby preventing harmful lateral bleeding while enabling effective bonding.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If component sizes are increased to accommodate adhesive bleeding, then adhesive bleeding tolerance is improved, but manufacturing cost increases and efficiency decreases

Engineering Contradiction:
Improveadhesive bleeding toleranceVSAvoidmanufacturing efficiency
Core Design Contradiction:
Object-affected harmful factorsVSProductivity

Solution Approach 1:

The harmful effect of adhesive bleeding is extracted and redirected into the trench region between the inner and outer dams. By providing a dedicated containment zone, the adhesive that would otherwise cause lateral bleeding is instead channeled into a controlled space, eliminating the need to increase component sizes while maintaining bleeding tolerance.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The bonding dam structure changes the parameters of adhesive flow by providing physical boundaries (inner and outer dams) that constrain lateral movement. This parameter change in adhesive flow behavior allows for reduced component dimensions while maintaining adequate tolerance for adhesive application variations.

Inventive Principle:
Principle #35Parameter changes

3Object-affected harmful factors

If component sizes are increased to accommodate adhesive bleeding, then adhesive bleeding tolerance is improved, but manufacturing cost increases

Engineering Contradiction:
Improveadhesive bleeding toleranceVSAvoidmanufacturing cost
Core Design Contradiction:
Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The bonding dam structure is segmented into inner and outer dams with a trench between them, creating distinct zones for adhesive containment. This segmentation allows the adhesive to be confined within specific regions, preventing lateral bleeding while maintaining bonding strength between substrates and optics systems.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The bonding dam structure introduces a vertical dimension to adhesive containment by creating raised dam structures with trenches. This dimensional change allows adhesive to be confined in the vertical space created by the dams rather than requiring larger horizontal component dimensions, thereby reducing material usage and manufacturing cost.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS10157943B2Trenched-bonding-dam device and manufacturing method for same
Publication Date: 2018.12.18 OMNIVISION TECHNOLOGIES INC
  • US10157943B2 patent drawing
  • US10157943B2 patent drawing
  • US10157943B2 patent drawing

AI summary

Trenched-bonding-dam devices and corresponding methods of manufacture are provided. A trenched-bonding-dam device includes a bonding dam structure positioned upon a top surface of a substrate. The bonding dam structure has a bottom surface attached to a top surface of the substrate, an inner dam surrounded by an outer dam, and a trench between the inner and outer dams. The device may further include an optics system including a lens and an adhesive positioned within a bonding region between a bottom surface of the optics system and a top surface of at least one of the inner and outer dams. The trench may be dimensioned to receive a portion of the excess adhesive flowing laterally out of the bonding region during bonding of the substrate to the optics system, laterally confining the excess adhesive and reducing lateral bleeding of the adhesive.