Trenched Bottom Electrode Molecular Devices

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Solution Overview

Problem

Current methods for fabricating molecular spintronics devices face challenges in mass production due to difficulties in using small molecules with lengths less than the insulator thickness, leading to issues with spin coherence, joule heating, and the production of atomically smooth and uniform thin insulators, which affects the performance and stability of molecular devices.

Innovation Solution

The development of Trenched Bottom Electrode and Liftoff based Molecular Devices (TBELMDs) that allow for the use of molecules with lengths smaller than the combined thickness of insulating barriers, enabling controlled charge and spin transport, and the use of multilayer ferromagnetic electrodes to create magnetic metamaterials with unique properties, such as solar cell effects, while maintaining low leakage current and long-term stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional microfabrication tools and sputtering processes are used to fabricate molecular devices, then mass production capability is achieved, but difficulty in producing atomically smooth and uniform thin insulators occurs

Engineering Contradiction:
Improvemass production capabilityVSAvoidinsulator uniformity
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent changes the deposition parameters by using atomic layer deposition (ALD) instead of sputtering, and specifically controls the insulator thickness to be in the range of 0.5-2 nm. This parameter change enables achieving atomically smooth and uniform insulators that are compatible with mass production processes

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent replaces the conventional sputtering process with atomic layer deposition (ALD). This substitution provides better control over thin film uniformity and smoothness while maintaining compatibility with standard microfabrication toolsets for mass production

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Adaptability or versatility

If insulator thickness is reduced to accommodate small molecules, then molecule utilization is improved, but spin coherence and device stability deteriorate

Engineering Contradiction:
Improvemolecule utilizationVSAvoidspin coherence
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent optimizes the insulator thickness to a specific range (0.5-2 nm) that balances two competing requirements: thin enough to allow small molecules (length < 1 nm) to bridge the gap, but thick enough to maintain spin coherence and device stability. This precise parameter control resolves the contradiction

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent introduces dynamic control of the insulator thickness based on the specific molecule being used. The thickness can be adjusted within the 0.5-2 nm range to match different molecule sizes and requirements, enabling both small molecule utilization and maintained spin coherence

Inventive Principle:
Principle #15Dynamics

3Length of moving object

If small molecules with length less than insulator thickness are used, then device miniaturization is achieved, but joule heating and spin coherence issues occur

Engineering Contradiction:
Improvemolecule lengthVSAvoidjoule heating
Core Design Contradiction:
Length of moving objectVSObject-generated harmful factors

Solution Approach 1:

The patent changes the insulator thickness parameter to be in the optimal range (0.5-2 nm) which reduces the electric field strength and consequently reduces joule heating in the molecular channel, while still allowing small molecules to function effectively

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses the insulator layer as a cushioning element that prevents excessive current density and joule heating. By carefully controlling the insulator thickness, it provides a buffer that protects the small molecule channel from harmful thermal effects while maintaining device miniaturization

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

TBELMDs enable the production of molecular devices with improved spin coherence, reduced joule heating, and enhanced stability, allowing for the creation of large-area solar cells and memory devices with tunable magnetic states, and the ability to sense chemicals and light, while maintaining low leakage current and long-term stability.

Implementation Method 1

oxidizing the bottom metal electrode to form an insulating barrier

Methodology Applied
Scientific EffectOxidation: Oxidation

Implementation Method 2

molecules are attached to metal electrodes through self-assembly

Methodology Applied
Scientific EffectSelf-assembly: Self-Assembly

Data Source

PatentUS10833162B2Trenched bottom electrode and liftoff based molecular devices
Publication Date: 2020.11.10 TYAGI PAWAN
  • US10833162B2 patent drawing
  • US10833162B2 patent drawing
  • US10833162B2 patent drawing

AI summary

A system and method for fabricating at least one of, a molecular device element and a TBELMD including depositing a first electrode material on an insulating substrate or layer, performing a photolithography process in the first electrode material, creating a trench component in the first electrode material with the photolithography process, determining a section of the electrode material to remove based on at least one of, a molecular device element and a TBELMD to be produced, removing the section of said first electrode material, oxidizing a portion of the first electrode material, creating a first insulator part from the oxidized portion of the first electrode material, in which the oxidized portion of the first electrode material includes at least a first electrode metal surface, depositing a second electrode material, and bridging the first and second electrode material.