Trenched Heat Spreader Structure for Thin Multi-Chip Packages
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Solution Overview
Problem
The increasing thickness of semiconductor packages due to stacked semiconductor chips leads to degraded heat dissipation characteristics, necessitating effective heat management to maintain high performance and reliability.
Innovation Solution
A semiconductor package design incorporating a substrate with multiple semiconductor chips and heat spreaders, where the heat spreaders are strategically positioned to cover and transfer heat efficiently, with specific geometries to ensure effective heat dissipation and prevent collisions or incomplete contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If more semiconductor chips are stacked to achieve high capacity, then the storage capacity increases, but the overall thickness increases and heat dissipation characteristics are degraded
Solution Approach 1:
The heat spreader is divided into multiple heat spreader layers corresponding to different stacks of semiconductor chips. Each heat spreader layer is positioned adjacent to specific semiconductor chips and has a lateral extent that covers the chips, enabling distributed heat management across different regions of the package rather than a single centralized heat spreader
Solution Approach 2:
The patent transitions from vertical heat dissipation (single direction through stacked chips) to lateral heat dissipation by extending heat spreader layers horizontally across multiple chip stacks. This dimensional change allows heat to be conducted laterally to heat dissipation structures, effectively managing heat in three-dimensional packages
2Length of stationary object
If the thickness of semiconductor package is reduced according to slimness tendency, then the package size decreases, but heat dissipation becomes more difficult
Solution Approach 1:
The heat dissipation approach shifts from the thickness direction (vertical) to the lateral direction by implementing heat spreader layers that extend horizontally. This allows heat to be managed in the planar dimensions rather than relying on vertical conduction through the thin package profile
3Temperature
If a heat spreader is designed to cover semiconductor chips effectively, then heat dissipation improves, but the heat spreader may collide with adjacent chips or fail to make complete contact
Solution Approach 1:
Each heat spreader layer is designed with specific lateral extents that correspond to the footprint of the semiconductor chips it serves. The heat spreader layers are positioned and dimensioned to cover only the necessary areas, ensuring adequate heat contact with target chips while maintaining clearance from adjacent chips in different stacks
Solution Approach 2:
Multiple heat spreader layers are arranged in a nested configuration where each layer is positioned at a different vertical level corresponding to different chip stacks. The lateral extents of nested heat spreader layers are designed to prevent collision while ensuring each layer makes proper contact with its associated chips
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances thermal characteristics and product reliability by ensuring effective heat transfer and distribution, addressing the challenge of heat dissipation in high-capacity, multi-functional semiconductor packages.
Implementation Method 1
a first heat spreader formed on the first semiconductor chip and the second semiconductor chip
Implementation Method 2
a second heat spreader which protrudes from the first heat spreader and covers the first semiconductor chip
Data Source
AI summary
A semiconductor package includes a substrate, first to third semiconductor chips disposed on the substrate, first to third heat transfer components, first and second heat spreaders, and a trench. The first semiconductor chip is between the second and third semiconductor chips. The first to third heat transfer components are disposed on the semiconductor chips, respectively. The first heat spreader is formed on the first to third heat transfer components. The second heat spreader protrudes from the first heat spreader. The trench is formed on the second heat spreader. The second heat spreader includes first and second side units spaced apart with the trench between. A distance between an outer surface of an uppermost part of the first side unit and an outer surface of an uppermost part of the second side unit is smaller than a width of an upper surface of the first semiconductor chip.