Tri-State Inductive Coupling for Stacked Semiconductor Data Transmission
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Solution Overview
Problem
Current 3D memory devices face challenges in achieving high data reliability, low power consumption, and reduced chip size due to interference issues in inductive coupling between stacked semiconductor chips, which affect data transmission accuracy and efficiency.
Innovation Solution
The use of tri-state transmission with inductors, where each inductor can be in a state of inducing an electromotive force in one direction, the opposite direction, or no force, allowing for fewer inductors on the chip surface and reduced power consumption, while preventing adjacent inductors from operating in opposite phases to minimize interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If inductive coupling is used for wireless interconnections between stacked chips, then chip size is reduced and bandwidth is increased, but interference between adjacent inductors increases causing noise and reducing data reliability
Solution Approach 1:
The patent applies local quality by assigning different operational characteristics to different inductors based on their spatial positions. Specifically, inductors are configured with different duty cycles or current magnitudes depending on whether they are adjacent to other active inductors, thereby locally adjusting the magnetic field strength to minimize interference while maintaining overall system performance.
Solution Approach 2:
The patent implements periodic action through duty cycle modulation where inductors are activated in a time-divided manner rather than simultaneously. By controlling the duty cycle of current flow through adjacent inductors, the system reduces overlapping magnetic field interference while maintaining data transmission reliability across the stacked chip architecture.
2Productivity
If more inductors are used on the chip surface to increase data transmission capacity, then bandwidth is increased, but power consumption increases and chip area is occupied
Solution Approach 1:
The patent applies periodic action by implementing duty cycle control where inductors are activated only during specific time intervals rather than continuously. This time-division multiplexing approach allows multiple inductors to share the transmission medium sequentially, increasing overall data transmission capacity while significantly reducing power consumption compared to continuous operation of all inductors.
Solution Approach 2:
The patent implements dynamics by making the inductor activation pattern adaptive and variable. The duty cycle and current magnitude are dynamically adjusted based on data transmission requirements and interference conditions, allowing the system to optimize the balance between data transmission capacity and power consumption in real-time operating conditions.
3Reliability
If inductors operate at high current levels to improve signal strength, then data transmission reliability is improved, but power consumption increases and interference with adjacent inductors increases
Solution Approach 1:
The patent applies local quality by adjusting the current magnitude and duty cycle of individual inductors based on their specific spatial location and neighboring inductor configurations. Inductors that are adjacent to other active inductors operate at lower current levels or with reduced duty cycles to minimize magnetic field interference, while non-adjacent inductors can operate at higher levels to maintain signal strength.
Solution Approach 2:
The patent converts the potentially harmful magnetic interference from adjacent inductors into a beneficial time-division multiplexing scheme. By controlling the duty cycles and current magnitudes, the system allows adjacent inductors to operate without simultaneous high-current pulses, thereby converting what would be interference into a structured, interference-free transmission pattern that improves overall reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables reliable and efficient data transmission with reduced noise and power consumption, allowing for more compact chip designs and higher data capacity by optimizing inductor states for data encoding and decoding.
Implementation Method 1
Each of the transmitter coils may flow an electric current responsive to a signal to be transmitted. Due to the currents of the transmitter coils, electromotive forces may be induced at the receiver coils
Data Source
AI summary
Method and Apparatuses for of transmitting data between semiconductor chips are described. An example apparatus includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip includes first and second inductors. The first semiconductor chip transmits a first combination of a plurality of data bits in logical value by flowing a first current through the first inductor and by flowing substantially no current through the second inductor. The second semiconductor chip includes third and fourth inductors that correspond respectively to the first and second inductors of the first semiconductor chip. The second semiconductor chip receives the first combination of the plurality of data bits in logical value by detecting an electromotive force at the third inductor responsive to the first current and by detecting substantially no electromotive force at the fourth inductor responsive to no current.