Triangular Bond Area Layout for Compact Semiconductor Leadframes
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor die packaging, the placement of a metal-plated bond area close to the die can increase the leadframe size, but if placed too close, it may interfere with the die attach process, and existing spot-plated leadframes face challenges in optimizing the bond area's location for minimal size increase while ensuring effective bonding.
Innovation Solution
A semiconductor package design featuring a leadframe with a carrier section where the semiconductor die is solder-bonded, and a metal-plated bond area with a substantially triangular shape is provided on the carrier section, using a metal different from the leadframe, and an electrical conductor is connected to the die pad and bonded to the metal-plated bond area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the metal-plated bond area is placed as close to the die as possible to minimize leadframe size increase, then the leadframe size is minimized, but it may interfere with the die attach process
Solution Approach 1:
The patent applies asymmetry by using a triangular-shaped metal-plated bond area instead of a symmetric circular or square shape. This asymmetric geometry allows the bond area to be positioned close to the die while maintaining sufficient clearance in critical directions, thus minimizing leadframe size without interfering with the die attach process
Solution Approach 2:
The patent resolves the spatial conflict by transitioning from a two-dimensional placement problem to a three-dimensional solution. The metal-plated bond area is formed with a triangular shape that extends in multiple directions from a corner of the die, utilizing angular space efficiently. This dimensional approach allows close proximity to the die while maintaining manufacturing accessibility
2Area of stationary object
If the metal-plated bond area is placed too close to the die, then the leadframe size is minimized, but it interferes with the die attach process
Solution Approach 1:
The asymmetric triangular shape of the metal-plated bond area creates an optimized spatial relationship with the die. The triangle's geometry provides sufficient clearance zones that prevent solder creepage and interference with die attach equipment, while still allowing the bond area to be positioned as close as possible to the die for minimal leadframe size
Solution Approach 2:
The patent applies local quality by creating a metal-plated bond area with distinct properties from the rest of the leadframe. The triangular shape is strategically positioned and sized to provide localized bonding functionality close to the die, while the specific geometry ensures that this localized feature does not compromise the overall reliability of the die attach process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design minimizes the leadframe size by using a triangular metal-plated bond area that is strategically aligned with the die's corner, reducing interference during die attach and maintaining high electrical and thermal performance.
Implementation Method 1
A metal-plated bond area is provided on the carrier section of the leadframe, wherein a metal of the metal-plated bond area is different from a metal of the leadframe
Implementation Method 2
the semiconductor die is solder-bonded to the carrier section with the second surface facing the carrier section
Data Source
AI summary
A semiconductor package includes a semiconductor die having a first surface and a second surface opposite the first surface. A die pad is disposed at the first surface of the semiconductor die. A leadframe includes a carrier section on which the semiconductor die is mounted. The semiconductor die is solder-bonded to the carrier section with the second surface facing the carrier section. A metal-plated bond area is provided on the carrier section of the leadframe. A metal of the metal-plated bond area is different from a metal of the leadframe. An electrical conductor is connected to the die pad and bonded to the metal-plated bond area. The metal-plated bond area has a substantially triangular shape.