Triangular Grid Radiating Element for Wide-Scan PCB Arrays
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Solution Overview
Problem
Existing radiating elements with a unit cell size of 0.25λ2 require a larger number of elements to form an array, leading to complex wiring, increased heat load, higher manufacturing costs, and more room for error, while prior art symmetric arrays are limited in scan angle and performance.
Innovation Solution
A non-equilateral triangular grid array with 0.3125λ2 unit cells, comprising higher order Floquet-mode structure layers and symmetrical metal layers, operates across a frequency range of 10.7 GHz to 14.5 GHz with a wide scan angle, reducing the number of elements needed and improving performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If smaller unit cells (0.25λ2) are used to form the array, then the array coverage area is maintained, but the number of radiating elements increases leading to complex wiring and higher manufacturing costs
Solution Approach 1:
The radiating element is segmented into multiple functional layers (first PCB metal layer, second PCB metal layer, third PCB metal layer) with each layer serving specific functions. This segmentation allows for optimized current distribution and reduced mutual coupling between adjacent elements, enabling larger unit cell size (0.3125λ2) while maintaining array performance and reducing the total number of elements required.
2Area of stationary object
If more radiating elements are used to form the array, then the array area coverage is improved, but the heat load and manufacturing costs increase
Solution Approach 1:
Multiple PCB metal layers are merged into a single integrated radiating element structure with through-hole vias connecting the layers. This merging creates a three-dimensional current distribution that reduces resistive heating in individual layers and distributes heat more effectively across the entire element, reducing overall heat load while maintaining large unit cell size and reducing total element count.
3Object-affected harmful factors
If symmetric array configuration is used, then surface wave suppression is improved, but the scan angle capability is limited
Solution Approach 1:
The radiating element employs an asymmetric configuration where the first, second, and third PCB metal layers have different geometric patterns and orientations. This asymmetric design breaks the symmetry that causes surface waves in conventional arrays, suppressing surface wave effects while simultaneously enabling wide scan angle capability (0-50 degrees) by controlling current distribution in three-dimensional space.
4Quantity of substance
If larger unit cells (0.3125λ2) are used, then the number of radiating elements is reduced, but the array precision and performance may deteriorate
Solution Approach 1:
The radiating element transitions from conventional two-dimensional planar structures to three-dimensional multi-layer configurations with vertical current paths through through-hole vias. This dimensional change allows larger unit cell size (0.3125λ2) while maintaining precise electromagnetic performance through controlled current distribution in the third dimension, reducing the number of elements needed without sacrificing array precision.
Data Source
AI summary
A radiating element including: Higher order Floquet Structure (HOFS) layers comprising a top PCB metal layer, a mid PCB metal layer, and a low PCB metal layer; component layers comprising electronics to connect to the HOFS layers; and a unit cell constructively defined by the HOFS layers, wherein the unit cell is capable of operating as a transceiver, the unit cell has an operating range of 10.7 GHz to 14.5 GHz, and an area of the unit cell is 0.3125λ2.