Triangular LED Module Carrier for Halogen Beam Matching
Solution Overview
Problem
Current LED retrofit headlamps struggle to replicate the radiation characteristics of halogen headlamps, particularly in terms of near-field and far-field luminance, due to differences in light emission and heat dissipation.
Innovation Solution
A carrier with a multisided structure is designed to accommodate lighting modules, featuring a mounting portion with a triangular cross-section and a heat sink body portion that protrudes sidewards, allowing for effective heat transport and electrical conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If LEDs are placed on a heat sink in a three-sided or four-sided arrangement, then heat dissipation is improved, but the wall thickness supporting the LEDs must be limited to 0.8 mm, making insulation of conductive tracks from the heat sink body very challenging
Solution Approach 1:
The mounting portion is segmented into multiple mounting faces (three-sided or four-sided structure) that can be independently configured. Each mounting face provides separate mounting areas for LEDs, allowing the conductive tracks on each face to be independently insulated from the heat sink body, thereby reducing the overall insulation complexity while maintaining effective heat dissipation across all faces.
2Manufacturing precision
If the wall thickness is reduced to 0.8 mm to meet near field requirements, then the radiation pattern can be matched, but it becomes very challenging to insulate conductive tracks from the heat sink body
Solution Approach 1:
The insulation solution moves from a two-dimensional planar approach to a three-dimensional approach by utilizing the spatial arrangement of multiple mounting faces. The conductive tracks are insulated in the dimension perpendicular to each mounting face, allowing thin wall thickness (0.8 mm) to be maintained while still providing adequate insulation through the multi-face geometry.
3Illumination intensity
If LEDs are connected in series to mimic halogen radiation pattern, then the radiation characteristic can be matched, but thermal management becomes more difficult due to the arrangement requirements
Solution Approach 1:
The heat sink body is designed to serve multiple functions simultaneously: it provides thermal management for all LEDs regardless of their electrical connection configuration, supports the multi-face mounting structure, and maintains the geometric arrangement necessary for radiation pattern matching. This universal design allows LEDs to be connected in series for radiation pattern matching while the heat sink independently handles thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution enables the precise mimicking of halogen bulb illumination patterns, while also improving thermal and electrical performance, thus addressing the challenges of heat dissipation and radiation pattern replication.
Implementation Method 1
a heat sink body portion arranged adjacent to the at least one mounting portion, wherein the heat sink body portion protrudes sidewards from the at least one mounting portion
Data Source
Figure 1a~1b
Figure 2a~2b
Figure 3
AI summary
The invention refers to a carrier (2) for at least one lighting module (4), the carrier (2) comprising: at least one mounting portion (6) for receiving the at least one lighting module (4), wherein the carrier (2) has a triangular cross section at least in sections with the at least one mounting portion (6) being arranged on an edge of the triangular cross section; and a heat sink body portion (8) arranged adjacent to the at least one mounting portion (6), wherein the heat sink body portion (8) protrudes sidewards from the at least one mounting portion (6). The invention further relates to a lighting device (12) and a method for producing such lighting device (12).