Triangular Light Chip Arrangement for Wearable Sensor Accuracy
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Solution Overview
Problem
Existing intelligent wearable devices with multiple light-emitting chips for monitoring blood oxygen and heart rate suffer from light scattering and inadequate heat dissipation, affecting monitoring accuracy and service life.
Innovation Solution
A sensing device with a substrate hosting red, infrared, and green light-emitting chips arranged in a triangular configuration, along with optimized back face pads for heat dissipation and an encapsulation layer to concentrate light emission and improve detection accuracy, while the manufacturing method involves precise encapsulation and wire bonding to enhance device performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple light-emitting chips are installed in the sensing device, then the monitoring function is improved, but the light scattering problem occurs and monitoring accuracy deteriorates
Solution Approach 1:
The sensing device is divided into multiple functional modules, each responsible for specific wavelength ranges. The substrate is segmented into multiple mounting regions for different light-emitting chips, with each chip positioned in a dedicated area to control light emission direction and reduce scattering between chips.
Solution Approach 2:
Optical elements such as lenses or light guides are introduced as intermediaries between the light-emitting chips and the skin surface. These optical elements focus and direct the light from multiple chips in a unified direction, preventing light scattering while maintaining the functionality of multiple chips.
2Duration of action of moving object
If multiple light-emitting chips work for a long time, then the monitoring duration is extended, but the heat dissipation becomes insufficient and service life deteriorates
Solution Approach 1:
The heat dissipation function is extracted as a separate subsystem from the light-emitting chip assembly. Independent heat dissipation structures such as heat sinks or thermal conduction paths are designed to actively manage heat removal, allowing the light-emitting chips to operate continuously without thermal accumulation affecting reliability.
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support for mounting the light-emitting chips, establishes electrical connections between chips and circuitry, and acts as a heat dissipation pathway. This multi-functionality integrates heat management into the core structure, enabling continuous operation while maintaining reliability.
3Area of stationary object
If the light-emitting chips are arranged closely to reduce device size, then the compactness is improved, but the light scattering increases and detection accuracy deteriorates
Solution Approach 1:
The light-emitting chips are arranged in a nested or layered configuration on the substrate, with optical elements positioned between the chips and the skin surface. This nesting allows multiple chips to occupy a compact area while the optical elements ensure their light emissions are focused in the same direction, preventing scattering and maintaining detection accuracy despite close spacing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves light emission concentration and detection accuracy while enhancing heat dissipation, thereby extending the service life and reliability of the sensing device.
Implementation Method 1
a red light chip, an infrared light chip, and a green light chip disposed on a front face of the substrate
Implementation Method 2
an encapsulation layer to concentrate light emission and improve detection accuracy
Implementation Method 3
optimized back face pads for heat dissipation
Data Source
AI summary
Provided are a sensing device and a manufacturing method thereof. The sensing device includes a substrate, a red light chip, an infrared light chip, and a green light chip. The red light chip, the infrared light chip, and the green light chip are disposed on the front face of the substrate. Five front face pads are disposed on the front face of the substrate. Five back face pads are disposed on the back face of the substrate. The third back face pad is connected to the fourth back face pad by a conductive line. One of the five front face pads is electrically connected to a corresponding one of the five back face pads.