Triangular Phased Array Antenna Subarray Thermal Management
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Solution Overview
Problem
Phased array antenna systems in aircraft and spacecraft face challenges in power management due to limited power sources, necessitating the development of power-efficient designs.
Innovation Solution
A phased array antenna assembly utilizing a thermally conductive foam substrate with radiating elements arranged in a triangular array, combined with a radome and amplifiers, which provides passive cooling and reduces the need for active cooling, enabling efficient power use and compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If active cooling systems are used to manage thermal heat in phased array antenna systems, then thermal management is improved, but power consumption increases and system complexity increases
Solution Approach 1:
The foam substrate performs thermal management functions automatically without requiring external power or control systems. The material's inherent thermal conductivity properties enable passive heat dissipation from the amplifier components, eliminating the need for active cooling systems that would consume power and add complexity.
Solution Approach 2:
The patent replaces mechanical active cooling systems (fans, pumps, heat sinks requiring power) with a passive thermal management approach using the foam substrate's material properties. This substitution eliminates moving parts and power requirements while maintaining effective thermal control.
2Temperature
If active cooling systems are used to manage thermal heat in phased array antenna systems, then thermal management is improved, but device complexity increases
Solution Approach 1:
The thermal management function is merged into the foam substrate itself, which serves dual purposes as both the mounting structure for the amplifier modules and the thermal management medium. This integration eliminates separate cooling systems and reduces overall system complexity.
Solution Approach 2:
The foam substrate autonomously manages thermal heat through its inherent thermal conductivity without requiring external control systems, sensors, or active components, thereby simplifying the system architecture.
3Ease of manufacture
If conventional substrate materials are used with radiating elements, then manufacturing is simplified, but thermal management capability is reduced
Solution Approach 1:
The patent employs a composite foam substrate that combines structural support capabilities with superior thermal management properties. This composite material integrates the functions of mechanical support and thermal dissipation into a single component, maintaining ease of manufacture while enhancing thermal performance.
Solution Approach 2:
The foam substrate serves multiple functions simultaneously: it provides mechanical support for the amplifier modules, acts as a thermal management medium through its conductivity, and serves as the bonding substrate for radiating elements. This multi-functionality eliminates the need for separate components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves power-efficient operation and reduces the size, weight, and complexity of phased array antenna systems by using passive cooling and GaN high power amplifiers, enhancing power efficiency and thermal management.
Implementation Method 1
a thermally conductive foam substrate
Data Source
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AI summary
Antenna subassemblies (100) suitable for use in panels of a phased array antenna assembly are disclosed e.g. for use in vehicles like aircrafts and satellites. An antenna subarray assembly (100) comprises a thermally conductive foam substrate (140), a plurality of radiating elements (150) bonded to the foam substrate, and a radome (170) disposed adjacent the radiating elements (150). The subarray assembly (100) presents a triangular shape when viewed in plan view, and the plurality of radiating elements (150) are arranged in a triangular array on the foam substrate (140). The thermally conductive foam enables passive cooling. Embodiments also describe MMIC amplifiers and thermal control by a phase change material.