Triangular Prism Light Sources for LCD Backlight Thermal Management

The patent employs asymmetric heat dissipation structures including heat dissipation fins with varying heights and angles, and a heat dissipation chamber with non-uniform geometry. This asymmetric design optimizes heat flow paths and enhances convective heat transfer, allowing efficient heat dissipation while maintaining manufacturing feasibility through standard molding processes.

The patent transitions from conventional two-dimensional light source arrangement to a three-dimensional packaging structure with vertical heat dissipation fins and multi-layered heat dissipation chambers. This dimensional expansion increases heat dissipation surface area and creates optimized thermal pathways without significantly increasing the horizontal footprint, thereby maintaining ease of manufacture while improving thermal performance.

The patent introduces an encapsulation film as an intermediary between the light source and the external environment. This film serves multiple functions: it protects the light source, manages heat transfer, and optimizes light extraction by reducing total internal reflection through controlled refraction, thereby improving emission efficiency without requiring complex packaging modifications.

The patent modifies optical parameters by using an encapsulation film with specific refractive index properties and by designing heat dissipation structures with optimized geometric parameters. These parameter changes reduce total reflection at interfaces and improve light extraction efficiency while maintaining relatively simple packaging structures.

The patent segments the heat dissipation function into distinct components: heat dissipation fins for convective cooling, heat dissipation chambers for thermal management, and encapsulation film for protective barrier. This segmentation allows each component to be optimized for its specific function while maintaining overall structural simplicity and enabling modular manufacturing approaches.

The patent converts the harmful effect of heat generation into a beneficial thermal management system. The heat dissipation fins and chambers are designed to utilize natural convection and radiation, turning the waste heat into a controlled thermal flow that extends component lifespan. The encapsulation film also transforms thermal stress into a protective mechanism by managing thermal expansion and contraction.