Triangular SSD Board Assembly for Capacity and Heat Dissipation
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Solution Overview
Problem
Existing SSD designs face challenges in maximizing memory capacity within a standard form factor like E1.S while maintaining efficient heat dissipation and minimizing power consumption.
Innovation Solution
A triangular board assembly configuration with flexible connectors and angled wing boards, combined with a thermally conductive support structure, allows for increased media packages and improved heat dissipation, optimizing space and thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a standard form factor (E1.S) is used for SSD, then the device fits standard enclosures and is easy to deploy, but the memory capacity is limited by the fixed dimensions
Solution Approach 1:
The patent transitions from a traditional planar board layout to a three-dimensional triangular prism configuration. Media packages are arranged in multiple layers stacked vertically, utilizing the vertical dimension to increase storage capacity within the same footprint. The triangular cross-section provides optimal space utilization in the third dimension while maintaining compatibility with standard E1.S form factor enclosures.
2Quantity of substance
If more media packages are added to increase memory capacity, then storage density improves, but heat dissipation becomes more difficult
Solution Approach 1:
The triangular board assembly is divided into multiple discrete media packages arranged in separate layers and positions. Each media package operates as an independent heat-generating unit, allowing for distributed thermal management. The segmentation enables strategic placement of high-capacity media while maintaining thermal zones that can be managed by the heatsink structure.
Solution Approach 2:
A heatsink is introduced as an intermediary thermal management component between the media packages and the environment. The heatsink absorbs heat from multiple media packages positioned on the triangular board and dissipates it through its extended surface area, enabling higher memory capacity while maintaining acceptable operating temperatures.
3Quantity of substance
If the board configuration is changed to triangular shape, then space utilization and memory capacity increase, but manufacturing complexity increases
Solution Approach 1:
The triangular board assembly serves multiple functions simultaneously: it provides the structural framework for mounting media packages, defines the thermal management zones, enables three-dimensional stacking configuration, and maintains compatibility with standard E1.S enclosures. This multi-functionality reduces the need for additional separate components, offsetting the increased manufacturing complexity of the triangular shape itself.
4Quantity of substance
If wing boards are added at angles to increase media package capacity, then memory density improves, but signal integrity may be compromised by flexible connectors
Solution Approach 1:
The wing boards are designed with flexible connectors that allow for controlled movement and positioning during assembly, then settle into fixed angular positions. This dynamic assembly process enables precise alignment of the angled wing boards with the main board, ensuring optimal signal transmission through the flexible connectors while maximizing the number of media packages that can be mounted.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The triangular configuration enables higher memory capacity and efficient heat dissipation, meeting thermal and form factor requirements without compromising signal integrity or airflow.
Implementation Method 1
a thermally conductive support structure, allows for increased media packages and improved heat dissipation
Data Source
AI summary
An embodiment of an electronic apparatus comprises a main board, a wing board electrically coupled to the main board by a flexible connector along an edge of the main board, wherein the wing board is arranged at an angle that is non-parallel with respect to the main board. Other embodiments are disclosed and claimed.