Triangular Board Assembly for E1.S SSD Capacity and Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing solid state drives (SSDs) face challenges in maximizing memory capacity within a standard form factor like the E1.S form factor while maintaining efficient heat dissipation and minimizing power consumption, as traditional stacked or perpendicular board arrangements limit space and airflow.
Innovation Solution
A triangular board assembly configuration with flexibly connected wings to the SSD main board, utilizing a triangular heatsink for improved heat dissipation and airflow, allowing for increased media package placement within the E1.S form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional stacked or perpendicular board arrangements are used, then the device structure is simple, but the memory capacity is limited and heat dissipation is inefficient
Solution Approach 1:
The patent transitions from traditional two-dimensional stacked or perpendicular board arrangements to a three-dimensional triangular pyramid configuration. The main board forms the base, while three wing boards extend from different edges at angled orientations, creating a spatial triangular structure that maximizes volume utilization within the E1.S form factor enclosure, thereby increasing memory capacity without excessive complexity
Solution Approach 2:
The triangular board assembly is nested within the E1.S form factor enclosure, with the main board and three wing boards arranged to fit efficiently within the standardized dimensions. The flexible connectors allow the wing boards to be positioned and secured within the enclosure space, creating a compact nested structure that maximizes capacity while adhering to form factor constraints
2Quantity of substance
If more media packages are placed on the board, then memory capacity increases, but heat dissipation becomes less efficient
Solution Approach 1:
The triangular pyramid configuration distributes media packages across multiple spatial planes and orientations. The wing boards extend at angled orientations rather than being stacked directly on top of each other, creating increased separation between heat-generating components and improving airflow paths in three-dimensional space, thereby enhancing heat dissipation efficiency while accommodating more media packages
Solution Approach 2:
The patent divides the media packages across four separate boards (one main board and three wing boards) rather than concentrating them on a single board. This segmentation distributes the heat load across multiple surfaces and improves thermal management by allowing heat to dissipate from multiple exposed faces of the triangular structure
3Quantity of substance
If more media packages are placed on the board, then memory capacity increases, but power consumption increases
Solution Approach 1:
The three-dimensional triangular arrangement optimizes the density of media packages within the E1.S form factor volume. By utilizing vertical and angular space rather than only horizontal stacking, the design fits more media packages within the same enclosure, increasing capacity without proportionally increasing power consumption through more efficient space utilization
4Quantity of substance
If the board arrangement is optimized for capacity, then memory capacity increases, but airflow is restricted
Solution Approach 1:
The triangular pyramid configuration creates multiple exposed surfaces and open angles that facilitate airflow from multiple directions. The wing boards are oriented at angles that prevent complete blockage of airflow paths, allowing cooling air to circulate through and around the media packages on all four boards, thereby maintaining ease of airflow while maximizing capacity
Solution Approach 2:
The asymmetric angular orientations of the three wing boards relative to the main board create irregular airflow channels that enhance convective cooling. The non-uniform spacing and angled positions prevent stagnant air pockets and promote consistent air circulation across all media packages, improving airflow efficiency compared to symmetric stacked arrangements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The triangular board assembly enhances memory capacity by accommodating more media packages while optimizing thermal performance and reducing power consumption, adhering to the E1.S form factor specifications.
Implementation Method 1
A triangular board assembly configuration with flexibly connected wings to the SSD main board, utilizing a triangular heatsink for improved heat dissipation
Implementation Method 2
utilizing a triangular heatsink for improved heat dissipation and airflow
Data Source
AI summary
An embodiment of an electronic apparatus comprises a main board, a wing board electrically coupled to the main board by a flexible connector along an edge of the main board, wherein the wing board is arranged at an angle that is non-parallel with respect to the main board. Other embodiments are disclosed and claimed.