Triaxial Magnetic Sensor Integration on Single CMOS Substrate
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Solution Overview
Problem
Existing magnetic sensing technologies cannot integrate X-axis, Y-axis, and Z-axis sensing components into a single wafer or chip, limiting their ability to provide triaxial sensing capabilities effectively.
Innovation Solution
A magnetic sensing apparatus is designed with a substrate featuring grooves, where a magnetic conductive unit is partially embedded and partially exposed to collect and output magnetic field signals, and an inducing unit is positioned alongside to measure magnetic field strength and direction in the third direction, allowing for integrated X-axis, Y-axis, and Z-axis sensing within a single chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If sensing parts for X-axis, Y-axis, and Z-axis are packaged together in system level using two independent wafers or chips, then triaxial sensing capability is achieved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges the sensing parts for X-axis, Y-axis, and Z-axis into a single integrated structure on one wafer or chip. The substrate contains sensing components for all three axes arranged in a planar configuration, eliminating the need for separate wafers or chips and their subsequent assembly. This integration directly reduces device complexity while maintaining full triaxial sensing capability.
Solution Approach 2:
The substrate serves as a universal platform that accommodates multiple sensing functions (X-axis, Y-axis, and Z-axis detection) within a single device. The design enables one chip to perform all triaxial sensing operations, replacing the need for multiple specialized components and their complex interconnections.
2Adaptability or versatility
If sensing parts for X-axis, Y-axis, and Z-axis are packaged together in system level using two independent wafers or chips, then triaxial sensing capability is achieved, but manufacturing precision and production ease deteriorate
Solution Approach 1:
The patent combines all sensing functions for three axes into a single manufacturing process on one wafer or chip. This eliminates the need for separate fabrication of multiple wafers and their subsequent assembly, significantly simplifying the production process and improving manufacturing precision through a unified fabrication approach.
Solution Approach 2:
The patent transitions from a three-dimensional assembly of multiple wafers or chips to a two-dimensional planar integration on a single substrate. By arranging X-axis, Y-axis, and Z-axis sensing components in a flat configuration on one chip, the design simplifies manufacturing while achieving full triaxial functionality.
3Adaptability or versatility
If separate wafers or chips are used for plane sensing and Z-direction sensing, then sensing functionality is achieved, but cost-effectiveness and competitiveness worsen
Solution Approach 1:
The patent merges plane sensing (X-axis, Y-axis) and Z-direction sensing into a single integrated chip structure. This consolidation eliminates the need for separate wafer fabrication and assembly processes, reducing production costs and improving cost-effectiveness while maintaining complete sensing functionality.
Solution Approach 2:
The substrate is designed as a universal sensing platform that provides X-axis, Y-axis, and Z-axis detection capabilities in a single device. This multi-functional design reduces the total number of components needed, lowering material costs, assembly costs, and overall production expenses while delivering comprehensive triaxial sensing functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the production of a magnetic sensing apparatus with integrated X, Y, and Z-axis sensing capabilities in a single wafer or chip, offering improved performance, manufacturability, and competitive pricing by using the same magnetic material for both units and incorporating CMOS circuits for enhanced functionality.
Implementation Method 1
a magnetic conductive unit, wherein a main part of the magnetic conductive unit is set in the groove, and a part of it is exposed outside the groove onto the surface of the substrate, to collect a magnetic field signal in a third direction and to output the magnetic field signal
Implementation Method 2
Anisotropic magneto-resistance material is used in the magnetic sensor to measure the magnetic induction strength in a space. Alloy material with crystal structure adopted here is very sensitive to outside magnetic field, and variation of magnetic field lead to variation of resistance of AMR.
Data Source
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AI summary
The present invention belongs to a magnetic sensing apparatus, magnetic induction method and preparation process thereof. The magnetic sensing apparatus comprises a third direction magnetic sensing component, and the third direction magnetic sensing component comprises: a substrate, a magnetic conductive unit, and an inducing unit. A peripheral ASIC circuit is integrated optionally on the single chip using a fully compatible process with standard CMOS process in the present invention.