Single-Chip Triaxial Magnetic Sensor Integration
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Solution Overview
Problem
Current magnetic sensing technologies require separate chips or wafers for two-axis and three-axis sensing, making it challenging to integrate a single chip solution for triaxial sensing with optimal performance and cost-effectiveness.
Innovation Solution
A magnetic sensing apparatus with X-axis, Y-axis, and Z-axis sensing components integrated into a single wafer or chip, utilizing a substrate with coupled magnetic sensing modules, where the magnetic conductive unit collects and outputs magnetic field signals, and the inducing unit measures magnetic field strength and direction, with optimized configurations for each axis, including relative locations, magnetization directions, and current directions to offset and measure signals effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If separate chips or wafers are used for two-axis and three-axis sensing, then manufacturing and assembly are simplified, but device complexity and integration level increase
Solution Approach 1:
The patent combines two-axis and three-axis magnetic sensing components into a single integrated chip structure. The sensing components are arranged in different layers and orientations within the same substrate, allowing triaxial magnetic field measurement without requiring separate chips or wafers. This merging approach reduces assembly complexity while maintaining manufacturing feasibility through standardized single-chip fabrication processes.
2Measurement precision
If sensing components are arranged in specific orientations to measure magnetic fields in multiple directions, then measurement precision improves, but device complexity increases
Solution Approach 1:
The patent utilizes vertical layering in the Z-direction to accommodate sensing components oriented in different directions. By arranging first and second sensing components in separate layers with different orientations (e.g., one layer for X-Y plane measurement, another for Z-axis measurement), the design achieves three-axis measurement capability without requiring complex in-plane arrangements. This dimensional approach simplifies the overall component layout while maintaining measurement precision across all three axes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables independent measurement of magnetic signals in X-axis, Y-axis, and Z-axis directions with high performance and competitive pricing, integrating a peripheral ASIC circuit using standard CMOS processes, facilitating easy production and integration.
Implementation Method 1
a magnetic conductive unit, main part of the magnetic conductive unit is set in the groove, and a part of it is exposed out the groove and to surface of the substrate, in order to collect magnetic field signal in the third direction
Implementation Method 2
electrical resistance of the magnetic material in the magnetic material layer is variable with the magnetic field strength and direction
Data Source
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AI summary
The present invention belongs to a technical field of electrical communication, refers to a magnetic sensing apparatus, and more particularly to a magnetic three-axis sensing apparatus in a single chip. The magnetic sensing apparatus comprises a third direction magnetic sensing component, and the third direction magnetic sensing component comprises a substrate and a pair of coupled magnetic sensing modules. The present invention also refers to a magnetic sensing method of the magnetic sensing apparatus above.