Triazine Polyether Resin for Low Dielectric Substrates

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Solution Overview

Problem

There is a demand for materials with low dielectric properties, specifically low dielectric constant and low dielectric loss tangent, for use in high-frequency electronic devices and components, such as substrates, resonators, and antennas, which also require mechanical and thermal stability.

Innovation Solution

A resin composition incorporating a triazine-containing polyether compound with a specific structure, which has a low dielectric constant, low dielectric loss tangent, high transparency, high solubility, and high heat resistance, is developed. This composition includes a triazine-containing polyether compound with a repeating unit represented by General Formula (1), combined with epoxy resin, bismaleimide resin, or cyanate resin, and may include inorganic fillers or flame retardants, suitable for use in devices transmitting and receiving high-frequency electromagnetic waves.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional resin materials are used, then mechanical strength and thermal stability are achieved, but dielectric constant and dielectric loss tangent are too high for high-frequency applications

Engineering Contradiction:

Improvedielectric propertyVSAvoidmechanical strength

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent employs composite materials by combining triazine-containing polyether compounds with aromatic polyether structures. This composite molecular structure achieves both low dielectric properties (Dk≤3.0, Df≤0.003) and excellent mechanical strength, resolving the contradiction between dielectric performance and mechanical properties through molecular-level composite design

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent changes the molecular structure parameters by introducing triazine rings into the polyether backbone and adjusting the aromatic group substitution patterns. These parameter changes in molecular structure directly reduce the dielectric constant and loss tangent while maintaining or improving mechanical strength through optimized molecular packing and intermolecular forces

Inventive Principle:

Principle #35Parameter changes

2Reliability

If ceramic filler is added to reduce dielectric constant, then dielectric property improves, but manufacturing complexity and processing difficulty increase

Engineering Contradiction:

Improvedielectric propertyVSAvoidmanufacturing ease

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent extracts and eliminates the need for ceramic fillers by achieving low dielectric properties through the intrinsic molecular structure of the triazine-containing polyether compound itself. This extraction of the filler component simplifies manufacturing processes while maintaining excellent dielectric performance (Dk≤3.0, Df≤0.003)

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent substitutes the mechanical approach of adding physical ceramic fillers with a chemical/molecular approach of designing low-dielectric molecular structures. This substitution replaces complex composite material processing with simpler polymer synthesis and processing, greatly easing manufacturing while achieving the same dielectric goals

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Temperature

If aromatic polyether structure is used, then heat resistance and mechanical strength are improved, but dielectric loss tangent increases

Engineering Contradiction:

Improveheat resistanceVSAvoiddielectric loss tangent

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent applies local quality by strategically placing triazine rings at specific positions within the polymer chain and controlling the substitution patterns of aromatic groups. This localized structural optimization reduces dielectric loss tangent in key regions while maintaining the overall heat resistance and mechanical strength provided by the aromatic polyether framework

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent changes molecular parameters by adjusting the ratio and positioning of triazine-containing units versus standard aromatic polyether units. By optimizing these compositional parameters, the material achieves low dielectric loss tangent (Df≤0.003) while maintaining high heat resistance (Tg≥200°C) through controlled molecular architecture

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS20240209148A1Resin composition for low-dielectric material, film for multilayer substrate, multilayer substrate, method for producing resin composition for low-dielectric material, method for producing film for multilayer substrate, and method for producing multilayer substrate

Publication Date: 2024.06.27 IWATE UNIVERSITY

AI summary

Provided are a resin composition which has a low dielectric constant, a low dielectric loss tangent, high transparency, high solubility, and high heat resistance and can be used suitably as a low-dielectric material, a film for a multilayer substrate, in which the resin composition is used, a multilayer substrate, and methods for producing the same. A resin composition for a low-dielectric material, which contains a triazine-containing polyether compound having a specific repeating unit, a film for a multilayer substrate, a multilayer substrate, a method for producing a resin composition for a low-dielectric material, a method for producing a film for a multilayer substrate, and a method for producing a multilayer substrate.