Triazolyl Cross-Linking Agent for Copper Adhesion and Resin Resistance
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Solution Overview
Problem
Existing resin compositions for semiconductor devices face issues with adhesion, heat resistance, chemical resistance, and discoloration when in contact with copper or copper alloys, often due to excessive additives leading to poor compatibility and performance trade-offs.
Innovation Solution
A triazolyl cross-linking agent with a specific formula containing a double bond, amide acid, or imide structure is introduced, enhancing adhesion to copper or copper alloy substrates while improving heat and chemical resistance, and inhibiting substrate discoloration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple additives are added to resin composition to improve adhesion, heat resistance, and chemical resistance, then comprehensive performance is enhanced, but additive content becomes excessive and reduces resin material performance
Solution Approach 1:
The patent combines multiple functional groups (triazolyl for adhesion and discoloration prevention, double bond for cross-linking, amide acid or imide for heat resistance) into a single cross-linking agent molecule. This merging approach allows one additive to provide multiple benefits that previously required separate additives, thereby improving comprehensive performance while reducing total additive content.
Solution Approach 2:
The triazolyl cross-linking agent is designed with multi-functionality: the triazolyl group provides adhesion to copper substrates and prevents discoloration, the double bond enables cross-linking reactions for film formation, and the amide acid or imide structure contributes heat resistance. This single compound performs multiple functions that previously required separate additives.
2Reliability
If multiple additives are added to achieve comprehensive performance, then adhesion and resistance properties improve, but compatibility between additives deteriorates
Solution Approach 1:
By merging multiple functional groups into a single cross-linking agent molecule, the patent eliminates compatibility issues between separate additives. The functional groups are covalently bonded within the same molecule, ensuring they work together synergistically without the compatibility problems that arise from mixing multiple separate additives.
3Reliability
If multiple additives are used to improve resin properties, then heat resistance and chemical resistance increase, but discoloration of copper substrate occurs
Solution Approach 1:
The triazolyl group acts as an intermediary between the resin and copper substrate. It provides adhesion while preventing direct contact between aggressive resin components and the copper, thereby preventing discoloration. Simultaneously, the amide acid or imide structure maintains heat resistance and chemical resistance properties.
4Strength
If excessive additives are added to improve adhesion, then adhesion strength increases, but film-forming properties deteriorate
Solution Approach 1:
The patent changes the chemical structure parameters of the cross-linking agent by incorporating specific functional groups in defined ratios. The triazolyl group provides adhesion, the double bond enables controlled cross-linking for good film formation, and the amide acid or imide structure maintains thermal properties. This parameter optimization allows both strong adhesion and good film-forming properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The triazolyl cross-linking agent improves film-forming properties, enhances adhesion, and provides better heat and chemical resistance to resin films, while preventing copper or copper alloy discoloration, thus addressing the performance trade-offs caused by excessive additives.
Implementation Method 1
triazolyl cross-linking agent has a general formula described in Formula I... improves film-forming properties, enhances adhesion, and provides better heat and chemical resistance
Implementation Method 2
W is an organic group shown in general formula (6) or (7)... R1 is an organic group containing a carbon-unsaturated double bond
Implementation Method 3
X1 and X2 are any one independently selected from the group consisting of structures described in formulae (2), (3), (4), and (5)... amide acid or imide structure
Data Source
AI summary
A cross-linking agent as well as a preparation method and the use thereof is disclosed. The structure of the cross-linking agent contains a triazolyl, and contains a double bond, an amide acid, or an imide structure at the same time. The cross-linking agent is added into a resin composition, so that the film-forming property can be improved, the adhesion between the cured resin and a copper or copper alloy base material is improved, the discoloration of the copper or copper alloy base material is inhibited, and meanwhile, the resin has better heat resistance and chemical resistance after curing. The problem of poor compatibility caused by excessive additive types is avoided, and meanwhile, the problem of excessive additives may be relieved.