Electronic Stack Dismantling Through Trigger-Sensitive Edge Separation
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Solution Overview
Problem
Modern electronic devices with sleek, integrated designs pose challenges for traditional recycling methods, leading to increased e-waste due to their compact form factors and encapsulation, making disassembly difficult without damaging components.
Innovation Solution
Incorporating a delamination layer between layers of the electronic stack, with a trigger-sensitive edge material to facilitate separation by forming an exposed flap, allowing easy disassembly without fluid injection, while maintaining structural integrity during use.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional recycling methods are used on modern electronic devices with sleek integrated designs, then the devices can be processed, but the disassembly becomes difficult and components may be damaged
Solution Approach 1:
The electronic device is divided into separate layers (first layer, second layer, and set of electronics) with delamination layers positioned between them. This segmentation allows the layers to be separated during recycling while maintaining the integrated appearance during use, directly resolving the contradiction between ease of disassembly and device complexity.
Solution Approach 2:
Delamination layers are introduced as intermediary elements between the first layer, second layer, and set of electronics. These intermediary layers facilitate separation during recycling without affecting the structural integrity or aesthetic appearance during normal device operation, enabling easy disassembly from complex integrated designs.
2Ease of manufacture
If delamination layers are applied to both sides of electronics, then separation during recycling is facilitated, but the risk of inadvertent delamination during product lifetime increases
Solution Approach 1:
Different regions of the delamination layer are designed with different properties: the first and second regions have adhesive forces strong enough to prevent inadvertent delamination during product lifetime, while the third region has reduced adhesive force to enable easy separation during recycling. This local differentiation resolves the contradiction between reliability during use and ease of separation.
Solution Approach 2:
The adhesive force parameter of the delamination layer is varied across different regions. The first and second regions maintain high adhesive force during normal operation, while the third region is designed with lower adhesive force that can be activated during recycling, thus resolving the contradiction between structural integrity and ease of separation.
3Ease of manufacture
If fluid injection passages are added to facilitate access to delamination layer, then separation is enabled, but the sleek waterproof design is compromised
Solution Approach 1:
Instead of providing full access to the entire delamination layer, the invention provides partial access through a restricted access region. This limited access is sufficient for recycling operations while maintaining the sleek aesthetic appearance without requiring visible fluid injection passages, thus resolving the contradiction between ease of access and aesthetic design.
4Productivity
If the delamination layer is made easily separable, then recycling is facilitated, but the layers may separate during product lifetime
Solution Approach 1:
The delamination layer exhibits different adhesive properties in different regions: the first and second regions maintain strong adhesion during product lifetime to ensure reliability, while the third region is designed with easier separability to facilitate recycling. This local quality differentiation resolves the contradiction between productivity in recycling and reliability during use.
Solution Approach 2:
The delamination layer is designed to remain stable during the product lifetime period and then become separable during the recycling period. This temporal differentiation of adhesive properties allows the layer to serve different functions at different times, resolving the contradiction between stability during use and ease of separation for recycling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient dismantling of electronic devices with minimal environmental impact by ensuring easy separation of components without damaging the device during recycling, while preserving waterproofness and structural integrity.
Implementation Method 1
the trigger-sensitive edge material is light-sensitive edge material and the trigger is light
Implementation Method 2
the trigger-sensitive edge material is heat-sensitive edge material and the trigger is heat
Implementation Method 3
the trigger-sensitive edge material is solvent-sensitive edge material and the trigger is solvent
Implementation Method 4
The delamination layer is dissolvable by a solvent, preferably water, and/or disintegrates when exposed to the solvent
Data Source
Figure 1A~1D
Figure 2A~2C
Figure 3A~3B
AI summary
A method of dismantling an electronic stack (10). The electronic stack (10) comprises a set of electronics (13) encapsulated between a first layer (11) and a second layer (12) and separated from the first and/or second layer (11,12) by a delamination layer (14). The electronic stack (10) further comprises an edge layer (15) formed of a trigger-sensitive edge material (M15) extending over an edge area (Ae) between an edge (14e) of the delamination layer (14) and an edge (10e) of the electronic stack (10). A trigger (T) is applied to the edge layer (15) causing degradation of the trigger-sensitive edge material (M15), thereby at least partially separating the first layer (11) from the second layer (12) and forming an exposed flap (16) to be gripped (G) to further pull apart the first and second layers (11,12). The pulling apart (P) may be further facilitated by the delamination layer (14).