Trilayer Fluoropolymer Adhesive Film for Consistent Conductor Spacing

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Solution Overview

Problem

Existing methods for bonding conductors in magnetic self-resonant structures for inductive wireless power transfer face challenges in maintaining consistent z-axis spacing and preventing excess bonding material from escaping, leading to inefficient and difficult-to-control layer thicknesses.

Innovation Solution

A trilayer polymer adhesive film with a core layer of polytetrafluoroethylene, perfluoroalkoxy polymer, or fluorinated ethylene propylene, and outer layers of fluoropolymers with lower melting temperatures, is used to bond patterned substrates, allowing for controlled spacing and filling of voids between conductor layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a single-layer bonding material is used to bond conductors, then the bonding process is simple, but the z-axis spacing between conductor layers is inconsistent and difficult to control

Engineering Contradiction:

Improvebonding process simplicityVSAvoidz-axis spacing consistency

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The bonding material is segmented into a trilayer structure with distinct functional layers: an outer adhesive layer for bonding, a core layer for maintaining consistent z-axis spacing, and another outer adhesive layer on the opposite side. This segmentation allows each layer to perform its specific function independently, resolving the contradiction between simple bonding and precise spacing control.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different layers of the bonding material are assigned different local qualities: the outer layers have adhesive properties for bonding conductors, while the core layer has rigid properties for maintaining spacing. This local differentiation enables the bonding material to simultaneously achieve easy bonding and precise z-axis spacing control.

Inventive Principle:

Principle #3Local quality

2Strength

If bonding material is applied to fill voids between patterned conductors, then adhesion is improved, but excess bonding material escapes and creates uneven layer thickness

Engineering Contradiction:

Improvebond adhesionVSAvoidlayer thickness uniformity

Core Design Contradiction:

StrengthVSManufacturing precision

Solution Approach 1:

The core layer acts as an intermediary between the outer adhesive layers, containing the adhesive material within the bonding interface. This intermediary structure prevents excess bonding material from escaping while still allowing the outer layers to provide strong adhesion by filling voids between patterned conductors, thus maintaining both strong bonding and uniform layer thickness.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Strength

If the bonding material is too soft to conform to patterned surfaces, then void filling is improved, but the structural integrity and spacing maintenance deteriorate

Engineering Contradiction:

Improvevoid filling capabilityVSAvoidspacing maintenance

Core Design Contradiction:

StrengthVSManufacturing precision

Solution Approach 1:

The bonding material is segmented into soft outer layers for void filling and a rigid core layer for spacing maintenance. This segmentation allows the soft outer layers to conform to patterned surfaces and fill voids, while the rigid core layer maintains the z-axis spacing and structural integrity, resolving the contradiction between void filling and spacing maintenance.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The trilayer polymer film enables efficient bonding of patterned conductors with consistent spacing between layers, reducing air gaps and improving the structural integrity of magnetic self-resonant structures for inductive wireless power transfer applications.

Implementation Method 1

the first outer layer and the second outer layer each independently comprises a fluoropolymer having a melting temperature that is at least 15° C. less than a melting temperature of the core layer

Methodology Applied

Scientific EffectMelting: Melting

Data Source

PatentUS20240336812A1Trilayer polymer adhesive film, method of bonding patterned substrates, multilayer conductor, and method of forming a multilayer conductor

Publication Date: 2024.10.10 ROGERS CORP

AI summary

A trilayer polymer film includes a core layer and first and second outer layers on opposing surfaces of the core layer. The compositions of each of the layers is as described herein, wherein the first outer layer and the second outer layer each independently include a fluoropolymer having a melting temperature that is at least 15° C. less than a melting temperature of the core layer. The film can be useful in the preparation of multilayer conductors and magnetic self-resonant structures.