Trilayer Silane-Grafted Encapsulant for Solar Module Stability
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Solution Overview
Problem
Existing electronic device modules, particularly solar cell modules, face issues with polymeric materials like EVA that degrade over time, turning yellow and producing corrosive substances, which can affect the modules' performance and longevity.
Innovation Solution
A trilayer polymeric material structure is used, where the back and front layers are ethylene interpolymers grafted with silane for high adhesion, and the intermediate layer is non-grafted for cost-effectiveness and stability, crosslinked with initiators and UV stabilizers, ensuring high optical clarity and long-term durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If EVA is used as the polymeric material, then the module can be manufactured with good initial adhesion and optical properties, but the encapsulant turns yellow and forms corrosive materials during aging
Solution Approach 1:
The patent changes the chemical composition parameters of the polymeric material from EVA to a silane-grafted polyethylene crosslinked system. This parameter change eliminates the yellowing and corrosive material formation issues inherent to EVA while maintaining adhesion and optical properties through the crosslinked network structure and silane functionality.
Solution Approach 2:
The patent employs a composite material system combining silane-grafted polyethylene with crosslinking agents and UV stabilizers. This composite approach creates a synergistic effect where the crosslinked structure provides stability and resistance to degradation, while UV stabilizers prevent photo-oxidation, collectively solving the yellowing and corrosivity problems of EVA.
2Strength
If a trilayer polymeric structure with silane-grafted layers is used, then adhesion to glass and electronic device surfaces is improved, but manufacturing complexity increases
Solution Approach 1:
The patent segments the polymeric encapsulant into a trilayer structure with distinct functional layers: outer layers providing adhesion through silane grafting, and an intermediate layer providing structural support. This segmentation allows each layer to be optimized for its specific function while maintaining overall manufacturability through co-extrusion or lamination processes.
Solution Approach 2:
The patent applies local quality by concentrating the expensive silane-grafted polymer only in the outer layers where adhesion is critical, while using a simpler, less expensive polymer in the intermediate bulk layer. This local application of enhanced properties optimizes performance at the interface while reducing overall material cost and processing complexity.
3Stability of the object's composition
If the entire polymeric material is crosslinked, then stability and creep resistance are improved, but adhesion to substrates decreases
Solution Approach 1:
The patent segments the crosslinking function to specific layers: the outer layers contain silane groups that crosslink to provide stability and creep resistance, while the intermediate layer remains non-crosslinked or less crosslinked to maintain flexibility and adhesion. This segmentation resolves the contradiction by localizing the crosslinking effect where it is most beneficial.
Solution Approach 2:
The patent applies local quality by varying the crosslinking density across different layers of the encapsulant. The outer layers have high crosslinking density for stability, while the intermediate layer has lower crosslinking density for adhesion, creating a gradient structure that optimizes both properties simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced adhesion, stability, and cost-effectiveness, leading to improved performance and extended lifetimes of electronic device modules with high optical clarity and resistance to creep, while maintaining ease of production and reduced material costs.
Implementation Method 1
a back layer 23, 43 which is adhered to a surface of the electronic device 3, a front layer 21, 41 which is adhered to the glass cover sheet 1 or the backsheet 5
Implementation Method 2
which is crosslinked with the aid of a crosslinking initiator and optionally a crosslinking coagent
Implementation Method 3
a UV stabilizer and optionally one or more additives
Data Source
AI summary
An electronic device module including a glass cover sheet, a polymeric front polymeric material, an electronic device, a polymeric back material and a backsheet, wherein the polymeric front and/or back materials have a trilayer structure including a back layer which is adhered to a surface of the electronic device, a front layer which is adhered to the glass cover sheet or the backsheet and an intermediate layer between the back layer and the front layer, wherein each of the back layer and the front layer includes an ethylene interpolymer grafted with silane, wherein the ethylene interpolymer grafted with silane has a density of at most 0.905 g/cm3, and the intermediate layer is a non-grafted ethylene interpolymer having a density of at most 0.905 g/cm3, which is crosslinked with the aid of a crosslinking initiator and optionally a crosslinking coagent, and optionally additives. A trilayer polymeric film having outer layers including ethylene interpolymers grafted with silanes and a non-grafted innerlayer containing a peroxide and UV stabilizer.