Triplate Line Antenna With Air Layer Substrate

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Solution Overview

Problem

Conventional antenna devices using triplate lines for frequency sharing require the central conductor to be divided into multiple blocks, increasing the number of components and complicating assembly due to the need for multiple parts.

Innovation Solution

The antenna device employs a triplate line configuration where at least part of the triplate line has two ground plates sandwiching a center substrate with a wiring pattern on a dielectric substrate via an air layer, allowing for easier assembly by integrating the central conductor into a substrate triplate structure, reducing the need for spacers and simplifying the assembly process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the central conductor plate is divided into plural blocks for frequency sharing, then frequency sharing capability is improved, but the number of parts increases and assembling work becomes troublesome

Engineering Contradiction:
Improvefrequency sharing capabilityVSAvoidnumber of parts
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent merges the central conductor plate into a single integrated substrate that incorporates wiring patterns for multiple frequency bands. This combines what would otherwise be separate conductor blocks into one unified structure, maintaining frequency sharing capability while reducing the number of discrete parts and simplifying assembly.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The substrate serves multiple functions simultaneously: it acts as the dielectric support structure, contains wiring patterns for multiple frequency bands, and provides the central conductor function. This multi-functionality eliminates the need for separate components for each frequency band, reducing part count while maintaining adaptability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If the central conductor plate is divided into plural blocks for frequency sharing, then frequency sharing capability is improved, but assembling work becomes troublesome

Engineering Contradiction:
Improvefrequency sharing capabilityVSAvoidassembling work
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent merges the central conductor plate into a single integrated substrate that incorporates wiring patterns for multiple frequency bands. This combines what would otherwise be separate conductor blocks into one unified structure, maintaining frequency sharing capability while reducing the number of discrete parts and simplifying assembly.

Inventive Principle:
Principle #5Merging (Combining)

3Strength

If spacers are used to support the central conductor, then structural support is improved, but the number of parts increases

Engineering Contradiction:
Improvestructural supportVSAvoidnumber of parts
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The substrate integrates both the dielectric support function and the central conductor function into a single component. This eliminates the need for separate spacers to support the central conductor, as the substrate itself provides the structural support while containing the wiring patterns, thereby reducing the total number of parts.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS9431718B2Antenna device including triplate line including central conductor and ground plates
Publication Date: 2016.08.30 PROTERIAL LTD
  • US9431718B2 patent drawing
  • US9431718B2 patent drawing
  • US9431718B2 patent drawing

AI summary

An antenna device has a feed line including a triplate line. Each triplate line has a central conductor and two ground plates sandwiching the central conductor via an air layer. At least a part of the triplate line is configured such that the two ground plates sandwich a center substrate including a wiring pattern as the central conductor provided on a dielectric substrate via the air layer.