Triple Patterning Lithography Color Conflict Reduction
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Solution Overview
Problem
Current photolithographic processes face limitations in printing small feature sizes and pitches due to physical constraints, leading to color conflicts in triple patterned integrated circuit designs, which hinder the fabrication of advanced ICs with dense layer layouts.
Innovation Solution
A method involving a design rule check (DRC) with restrictive design rules and conflict graph analysis is applied to determine the colorability of IC layouts, allowing for partial coloring and identification of non-colorable shapes, thereby reducing color conflicts in triple patterned designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithographic processes are used to print small feature sizes and pitches, then manufacturing precision is improved, but color conflicts occur in triple patterned designs
Solution Approach 1:
The patent applies preliminary actions by performing design rule checks and conflict graph analysis before the actual photolithographic printing process. The system identifies potential color conflicts in advance and adjusts the layout or coloring strategy to prevent conflicts from occurring during fabrication, thereby maintaining both manufacturing precision and reliability
2Manufacturing precision
If triple patterning lithography is used to print dense layouts, then manufacturing precision is improved, but color conflicts increase
Solution Approach 1:
The patent implements feedback mechanisms through automated design rule checks and conflict graph analysis that evaluate the layout and coloring assignments. When potential color conflicts are detected, the system provides feedback to adjust the coloring strategy or layout configuration, enabling dense layout printing while managing color conflict complexity through iterative optimization
3Device complexity
If traditional photolithographic processes are used, then device complexity is reduced, but manufacturing precision deteriorates for advanced ICs
Solution Approach 1:
The patent applies segmentation by dividing the single photolithographic printing process into triple patterning lithography, which uses multiple exposure steps with different color assignments. This segmentation allows the system to achieve the manufacturing precision required for advanced ICs with smaller feature sizes and pitches, while the automated coloring algorithms help manage the increased process complexity
Data Source
AI summary
Methods of the present disclosure can include: using a computing device to perform actions including: applying a design rule check (DRC) on a proposed integrated circuit (IC) layout, wherein the DRC applies a set of restrictive design rules (RDRs) in response to the proposed IC layout being a contact area (CA) layout; computing a conflict graph for the proposed IC layout in response to one of the IC layout being a metal layer layout and the set of RDRs being satisfied; determining whether the IC layout is one of non-colorable, indeterminate, partially colorable, and fully colorable; and partially coloring the IC layout and identifying non-colorable nodes in response to the IC layout being indeterminate or partially colorable.