Triptycene Pattern Film for Fine Etching-Resistant Structures

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Solution Overview

Problem

Existing pattern forming methods struggle to create fine pattern structures with adequate etching resistance.

Innovation Solution

A pattern forming method utilizing a triptycene derivative with a triptycene skeleton and side chains of differing etching selectivity ratios, forming a self-assembled pattern film that includes a first side chain and a second side chain, which are bonded to the triptycene skeleton in specific orientations to enhance etching resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional pattern forming methods are used, then the pattern formation process is simple, but the etching resistance of the formed pattern is insufficient

Engineering Contradiction:
Improveetching resistanceVSAvoidpattern film structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent employs a block copolymer comprising a first block with aromatic rings (providing etching resistance) and a second block with different properties (enabling self-assembly). This composite structure combines materials with complementary functions to achieve both high etching resistance and fine pattern formation capability, resolving the contradiction between reliability and device complexity.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The pattern film is segmented into distinct functional blocks: a first block containing aromatic rings for etching resistance and a second block for self-assembly. This segmentation allows each block to perform its specific function optimally, with the aromatic block providing chemical stability during etching while the other block enables precise pattern formation through self-organization.

Inventive Principle:
Principle #1Segmentation

2Manufacturing precision

If fine pattern structures are formed, then the pattern dimension precision is improved, but the etching resistance decreases

Engineering Contradiction:
Improvepattern dimension precisionVSAvoidetching resistance
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent applies local quality by concentrating aromatic ring-containing blocks specifically at regions requiring etching resistance, while other blocks handle pattern formation. This localized functional distribution ensures that etching resistance is enhanced precisely where needed (in the pattern structures) without compromising the overall self-assembly capability and dimension precision.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

By combining blocks with aromatic rings (for etching resistance) and blocks optimized for self-assembly (for dimension precision), the patent creates a composite material that simultaneously achieves both fine pattern dimensions and high etching resistance, eliminating the trade-off between these two critical parameters.

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS12630724B2Pattern forming method and plasma processing method
Publication Date: 2026.05.19 TOKYO ELECTRON LTD
  • US12630724B2 patent drawing
  • US12630724B2 patent drawing
  • US12630724B2 patent drawing

AI summary

A pattern forming method includes forming a pattern film on a substrate. The pattern film includes a triptycene derivative having a triptycene skeleton. The triptycene skeleton includes a first plane in which position 1, position 8, and position 13 of the triptycene skeleton are arranged, and a second plane in which position 4, position 5, and position 16 of the triptycene skeleton are arranged. The triptycene derivative includes a first side chain on a one plane side, the one plane side being on a side of one plane from among the first plane and the second plane, and a second side chain on another plane side or on the one plane side, the another plane side being on a side of another plane from among the first plane and the second plane. The second side chain is different from the first side chain in an etching selectivity ratio.