Trisphenol Compound Single Bond Connectivity for Resist Solubility
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Solution Overview
Problem
Trisphenol compounds used in photosensitive resist materials face challenges with sensitivity, resolution, heat resistance, and storage stability, necessitating improvements in their structure for enhanced solubility and performance.
Innovation Solution
A trisphenol compound with a phenylalkylidene group bonded to the phenyl nucleus and hydroxyphenyl group, offering improved solubility and heat resistance, is developed, allowing for better performance in photosensitive resist applications and other materials like aromatic polycarbonate resins and epoxy resins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional trisphenol structures (e.g., TrisP-PA with 2,2-propylidene group) are used, then heat resistance is achieved, but solubility in organic solvents is insufficient
Solution Approach 1:
The patent changes the bonding group parameter from 2,2-propylidene to single bond, and modifies substituent parameters (R groups) to achieve both improved solubility and heat resistance. Specifically, compounds with single bond connectivity and specific R group configurations (formula 1) demonstrate enhanced solubility in organic solvents while maintaining high glass transition temperatures (heat resistance).
Solution Approach 2:
The patent creates composite molecular structures combining phenylalkylidene groups with hydroxyphenyl groups in specific configurations. The trisphenol compounds with single bond connectivity and strategically placed substituents form a composite structure that integrates both solubility-enhancing and heat-resistant characteristics.
2Stability of the object's composition
If conventional trisphenol structures are used, then material stability is maintained, but sensitivity and resolution in photosensitive resist are insufficient
Solution Approach 1:
The patent modifies molecular parameters including bonding connectivity (to single bond) and substituent types to simultaneously improve sensitivity and resolution while maintaining storage stability. The specific formula 1 structures with controlled R groups achieve this balance.
3Ease of manufacture
If trisphenol structure is modified to improve solubility, then heat resistance may deteriorate, but the invention achieves both improvements
Solution Approach 1:
The patent successfully changes multiple parameters simultaneously: bonding group (to single bond), substituent types (R groups), and molecular configuration. These coordinated parameter changes in formula 1 compounds produce both improved solubility and enhanced heat resistance (higher glass transition temperatures).
Data Source
AI summary
A trisphenol compound is expressed by formula (1), wherein R represents an alkyl group or alkoxyl group with 1 to 8 carbon atoms, phenyl group or hydroxyl group; R1 represents an alkyl group or alkoxyl group with 1 to 8 carbon atoms, or phenyl group; R2 represents an alkyl group or alkoxyl group with 1 to 8 carbon atoms; R3 represents a hydrogen atom or alkyl group with 1 to 8 carbon atoms; a represents 0, 1, 2, or 3; b represents 1 or 2; and c and d represent 0, 1, 2, 3, or 4; where the sum of b and c is 5 or less; R's may be either the same or different when a is 2 or more; R1's may be either the same or different when c is 2 or more; and R2's may be either the same or different when d is 2 or more.