On-Chip Temperature Sensors for Trojan Circuit Detection
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Solution Overview
Problem
The increasing trend of chip fabrication in less controlled manufacturing environments due to globalization has led to high security risks from malicious hardware Trojans, which existing detection methods struggle to address effectively, particularly in identifying small power dissipations without causing performance degradation.
Innovation Solution
The integration of small on-chip temperature sensors throughout the chip to sense power dissipation, allowing for the detection of malicious circuits by comparing signal deviations from a baseline, without affecting the primary circuitry and enabling detection of low power dissipations below 1 μW.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If on-chip temperature sensors are integrated to detect power dissipation, then detection precision of malicious circuits is improved, but device complexity increases
Solution Approach 1:
The chip is divided into multiple monitoring regions, each equipped with temperature sensors that independently monitor power dissipation in specific areas. This segmentation allows distributed detection across the chip without requiring a single complex centralized system, thereby improving detection precision while managing device complexity through modular deployment
Solution Approach 2:
The temperature sensors serve multiple functions: they monitor power dissipation for Trojan detection, track thermal conditions for reliability, and provide data for power management. This multi-functionality allows the same sensor infrastructure to address multiple concerns simultaneously, improving detection precision without proportionally increasing device complexity
2Measurement precision
If the number of temperature sensors is increased to detect small power dissipations, then detection precision is improved, but manufacturing cost increases
Solution Approach 1:
Temperature sensors are strategically placed in regions where Trojans are most likely to be inserted or where power dissipation patterns are most indicative of malicious activity. This localized deployment approach concentrates sensing resources in critical areas, improving detection precision for small power dissipations without requiring uniform sensor coverage across the entire chip, thereby controlling manufacturing cost
Solution Approach 2:
Instead of deploying sensors at every possible location, the system uses a partial deployment strategy where sensors are placed at key monitoring points that provide sufficient detection capability for small power dissipations. This partial action approach achieves adequate detection precision without the excessive cost of complete coverage
3Measurement precision
If temperature sensors are placed close to primary circuitry for accurate measurement, then measurement precision is improved, but the risk of electrical interference increases
Solution Approach 1:
The patent introduces thermal coupling as an intermediary mechanism between the primary circuitry and temperature sensors. Rather than direct electrical contact, sensors measure temperature changes in the substrate or adjacent layers that result from power dissipation. This thermal intermediary approach allows accurate measurement of power dissipation while electrically isolating the sensors from the primary circuitry, preventing electrical interference
Solution Approach 2:
The system replaces electrical measurement methods with thermal measurement methods. Instead of using electrical probes that would directly contact circuit nodes, the patent uses temperature sensors that detect thermal effects of power dissipation through the substrate. This substitution of measurement domain (from electrical to thermal) enables close proximity monitoring without electrical interference
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides non-intrusive, efficient detection of malicious hardware without performance degradation, capable of identifying deviations as low as 0.001° C., effectively addressing the challenge of detecting small Trojan circuits without external equipment, suitable for various chip types including digital, analog, and mixed-signal systems.
Implementation Method 1
temperature sensors thermally coupled to the primary circuitry through one or more of the layered semiconductor materials... obtaining a signal from the temperature sensors and the auxiliary circuitry indicative of power dissipation by the primary circuitry
Implementation Method 2
temperature sensors formed in layered semiconductor materials... obtaining a signal from the temperature sensors indicative of power dissipation... comparing the obtained signal to a baseline signal to determine a deviation
Data Source
AI summary
A method for detecting a malicious circuit on an integrated circuit chip is provided, in which temperature sensors are thermally coupled to primary circuitry on the chip. Signals obtained from the temperature sensors are indicative of power dissipation by the primary circuity on the integrated circuit chip. Comparison with a baseline signal, or golden signature, can be used to determine the presence of a malicious circuit in the primary circuitry.