TSOP Package Integrating MOSFET and Schottky Diode for DC-DC Converters

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional packaging configurations for MOSFET and Schottky diode in DC-DC converters result in inefficient voltage conversion due to long current paths, complicating circuit design and increasing production costs.

Innovation Solution

A novel TSOP package layout where the D terminal of the MOSFET is arranged on the same side as the K terminal of the Schottky diode, reducing the current path length and enhancing wire bonding security, with specific leadframe configurations for improved heat dissipation and structural integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If conventional dual-chip leadframe package configuration is used, then the MOSFET and Schottky diode can be connected between battery and protective switch, but the current path becomes long which adversely affects voltage conversion efficiency

Engineering Contradiction:

Improvevoltage conversion efficiencyVSAvoidcurrent path length

Core Design Contradiction:

Loss of energyVSLength of stationary object

Solution Approach 1:

The patent combines the MOSFET and Schottky diode into a single integrated package with shared leadframe structure. The leadframe leads are configured to provide direct electrical connection between the MOSFET drain and Schottky diode cathode, eliminating the need for external connection traces and reducing the current path length significantly. This merging of components and their interconnections resolves the contradiction by reducing energy loss through shorter current paths.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent transitions from a conventional planar layout to a three-dimensional integrated package structure. By stacking the MOSFET and Schottky diode chips vertically and using internal leadframe connections, the current path is shortened from traversing across the PCB surface to flowing through compact internal bonds within the package. This dimensional reorganization reduces the current path length while maintaining all necessary electrical connections.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If conventional packaging configuration is used, then the MOSFET and Schottky diode can be implemented in DC-DC converter, but the circuit design becomes complicated and production cost increases

Engineering Contradiction:

Improvecircuit design simplicityVSAvoidcircuit design complexity

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent merges the MOSFET and Schottky diode into a single functional module with pre-configured leadframe connections. This integration simplifies the circuit design by reducing the number of discrete components and their interconnections on the PCB. The unified package provides a straightforward replacement solution that reduces design complexity and manufacturing complexity simultaneously.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS8089139B2Small outline package in which MOSFET and Schottky diode being co-packaged

Publication Date: 2012.01.03 ALPHA & OMEGA SEMICONDUCTOR LTD

AI summary

A TSOP (Thin Small Outline Package) contains a MOSFET and a Schottky diode. The MOSFET has a source terminal a gate terminal and a drain terminal. The Schottky diode has a cathode terminal, a anode terminal. The TSOP contains the MOSFET and the Schottky diode with a special configuration by placing the drain terminal of the MOSFET and the anode terminal of the Schottky diode on a same side. Specifically, the TSOP implements a leadframe that comprises a plurality of leads. The drain terminal of the MOSFET and the anode terminal extends outside of the TSOP separate on the same side of the package.