TSV Binary-Tree Testing for Local Fault Isolation in Packages
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Solution Overview
Problem
Existing semiconductor package testing methods for through via structures, such as daisy chain schemes, are inadequate in identifying local malfunctions and often require additional circuit components, leading to inefficiencies in determining the functionality of through-silicon/substrate-via structures.
Innovation Solution
Implementing a binary-tree structure configuration for TSVs, where each TSV is coupled through branch structures, allowing for localized testing of each TSV structure by propagating input and output test signals through a binary-tree scheme, enabling efficient identification of malfunctions without additional circuit components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If daisy chain testing scheme is used for TSV structures, then testing can be performed, but local malfunctions cannot be identified and additional circuit components are required
Solution Approach 1:
The patent divides the TSV testing process into segmented groups where TSV structures are organized in hierarchical levels. Each level contains multiple TSV structures that can be tested independently through selective electrical connection, enabling localized malfunction identification without requiring additional circuit components throughout the entire device.
2Reliability
If additional circuit components are added for testing, then testing functionality is improved, but device complexity increases
Solution Approach 1:
The patent implements a self-service testing mechanism where the TSV structures themselves serve as the testing pathways. By selectively electrically connecting TSV structures in different levels through their existing conductive paths, the device tests itself without requiring external additional circuit components, thus maintaining reliability while minimizing complexity.
3Device complexity
If traditional testing methods are used, then simplicity is maintained, but efficiency in determining TSV functionality is reduced
Solution Approach 1:
The patent introduces dynamic testing capability where the electrical connection configuration between TSV structures can be selectively changed based on testing requirements. Test signals can be dynamically routed through different levels and groups of TSV structures, allowing efficient determination of TSV functionality while maintaining structural simplicity through adaptive connection schemes.
Data Source
AI summary
A semiconductor package includes an array of through-substrate-via (TSV) structures comprising a number (O) of TSV structures; a number (N) of contact structures, the contact structures comprising a plurality of pairs configured to receive an input test signal and provide an output test signal, respectively; and a plurality of binary-tree branches, each of the plurality of binary-tree branches electrically coupling a first one of the TSV structures to a second one of the TSV structures and a third one of the TSV structures.